The sputtering target specifications involve a range of parameters that ensure the quality and performance of the sputtered coatings. These specifications include size, flatness, purity, impurity content, density, N/O/C/S levels, grain size, defect control, surface roughness, resistance, grain size uniformity, composition and tissue uniformity, oxide content and size, magnetic permeability, ultra-high density, and ultra-fine grains. These targets are used in magnetron sputtering, a physical vapor deposition method where high-energy electrons are used to sputter atoms from the target material, which then deposit as a thin film on a substrate.
Size and Flatness: The size of the sputtering target must match the requirements of the sputtering equipment, ensuring that the target covers the necessary area for uniform coating. Flatness is crucial to maintain uniform sputtering across the target surface, preventing areas of thicker or thinner coatings.
Purity and Impurity Content: High purity is essential to prevent impurities from affecting the properties of the deposited film. Impurity content must be minimized to ensure the film's integrity and performance.
Density: High density in the target material is necessary to prevent voids or pores that could lead to non-uniform sputtering and poor film quality.
N/O/C/S Levels: These elements, if present in high levels, can affect the film's properties. Controlling their levels is crucial for achieving the desired film characteristics.
Grain Size and Uniformity: The grain size of the target material can influence the grain size of the deposited film, affecting its mechanical and electrical properties. Uniform grain size across the target ensures consistent film properties.
Defect Control: Minimizing defects such as cracks, inclusions, and porosity is critical for maintaining high-quality sputtering and preventing premature target failure.
Surface Roughness: A smooth surface on the target promotes uniform sputtering and reduces the risk of arcing, which can damage the target and the substrate.
Resistance: The electrical resistance of the target material can affect the efficiency of the sputtering process and the quality of the deposited film.
Composition and Tissue Uniformity: Uniform composition across the target ensures that the film properties are consistent across the coated area. Tissue uniformity refers to the microstructure of the target material, which must be homogeneous to achieve uniform sputtering.
Oxide Content and Size: Oxide content and size can affect the adhesion and electrical properties of the film. Controlling these factors is important for certain applications.
Magnetic Permeability: For magnetron sputtering, the magnetic permeability of the target material can influence the efficiency of the sputtering process.
Ultra-High Density and Ultra-Fine Grains: These characteristics are often required for advanced applications where high performance and precision are necessary.
The manufacturing processes for sputtering targets, such as classical and vacuum hot-pressing, cold-pressing and sintering, and vacuum melting and casting, are tailored to achieve these specifications. Each production lot undergoes rigorous analytical processes to ensure compliance with the high-quality standards required for sputtering targets.
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