Sputtering is a physical vapor deposition (PVD) technique.
It involves the ejection of atoms or molecules from a target material.
This ejection happens through high-energy particle bombardment.
These particles then condense on a substrate as a thin film.
This process is widely used for depositing metallic films, including aluminum, on various substrates.
4 Steps Explained
1. Setup and Initialization
The deposition chamber contains a sputter gun with the target material, such as aluminum.
Strong magnets behind the target create a magnetic field.
This magnetic field is crucial for the sputtering process.
2. Gas Introduction
Argon gas is introduced into the chamber.
This inert gas is preferred to avoid chemical reactions with the target material.
3. Power Application
High voltage DC power is applied to the cathode.
The cathode houses the sputter gun and target material.
This initial power ramp-up cleans the target and substrate.
4. Sputtering
Energetic positive ions from the ionized argon bombard the target.
These ions eject particles that travel across the chamber.
The ejected particles deposit on the substrate as a thin film.
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