The process of sputtering target involves the deposition of thin films onto a substrate using a physical vapor deposition (PVD) technique.
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Introduction to the Vacuum Chamber: The substrate to be coated is placed inside a vacuum chamber.
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This chamber contains two magnets and is initially evacuated to create a vacuum environment.
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The base pressure in the chamber is extremely low, typically around 10^-6 millibar, which is about a billionth part of the normal atmospheric pressure.
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Introduction of Inert Gas: A controlled gas, usually argon, which is chemically inert, is introduced into the vacuum chamber.
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The gas atoms flow continuously, creating a low gas pressure atmosphere suitable for the sputtering process.
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Generation of Plasma: An electrical current is applied to a cathode within the chamber.
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This cathode, also known as the target, is made of the material that will be deposited onto the substrate.
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The application of electricity ionizes the argon gas, turning it into a plasma.
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In this state, the gas atoms become positively charged ions by losing electrons.
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Sputtering of Target Material: The ionized gas atoms are accelerated by a magnetic field towards the target.
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When they hit the target, they dislocate atoms or molecules from the target material.
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This process is known as sputtering. The sputtered material forms a vapor stream.
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Deposition onto Substrate: The vaporized material from the target travels through the chamber and deposits onto the substrate, forming a thin film or coating.
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This film is typically uniform and adheres well to the substrate.
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Cooling and Control: During the process, the target is cooled using water to dissipate the heat generated.
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This is crucial for maintaining the integrity of the target material and preventing damage to the equipment.
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Quality Control and Analysis: After the sputtering process, the quality of the deposited film is analyzed.
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Each production lot of material undergoes various analytical processes to ensure it meets the required standards.
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A certificate of analysis is provided with each shipment to certify the quality of the sputtering targets.
This process is crucial in various industries, especially in the production of semiconductors, where it is used to form conductive layers.
The sputtering targets must ensure high chemical purity and metallurgical uniformity to meet the stringent requirements of these applications.
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