Argon is commonly used in sputtering processes primarily because of its high sputtering rate, inert nature, low cost, and availability in high purity. These characteristics make it an ideal choice for the formation of thin films and coatings in various industrial applications.
High Sputtering Rate: Argon, being a noble gas with a relatively high atomic weight, provides a suitable source of ions for effective bombardment of the target material. The positively charged argon ions are attracted to the negatively charged target at high velocity, which results in a high rate of sputtering. This efficient removal of material from the target surface leads to faster deposition rates, making the process more time-effective.
Inert Nature: Argon is chemically inert, meaning it does not react with most materials. This is crucial in sputtering processes where the integrity of the target material and the deposited film is essential. The inertness of argon ensures that the sputtered particles are not contaminated or altered by the sputtering gas, preserving the desired properties of the thin film.
Low Price and Availability: Argon is relatively inexpensive compared to other noble gases like krypton and xenon. Its widespread availability and low cost make it a practical choice for industrial applications where cost-effectiveness is a significant consideration. The ability to obtain argon in high purity also supports the production of high-quality thin films without the risk of impurities affecting the film properties.
Other Considerations: The use of argon in sputtering also facilitates the operation of the process in various orientations and allows for coating complex shapes. Since no melting of the source material is required, the process can be adapted to different configurations, enhancing its versatility. Additionally, the use of argon can lead to denser layers with less scattering of material, improving the overall quality of the deposited films.
In summary, argon's combination of high sputtering rate, inertness, affordability, and availability make it the preferred choice for sputtering processes across various industries, ensuring efficient and high-quality thin film deposition.
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