When it comes to the sputtering of metals, argon gas plays a crucial role.
5 Key Reasons Why Argon Gas is Used During Metal Sputtering
1. Inert Nature
Argon is an inert gas, meaning it doesn't easily react with other elements.
This is important because during sputtering, gas ions recombine with the target material to produce the deposited film.
Using an inert gas like argon ensures that the film is not contaminated by reactions with other gases.
2. High Atomic Mass
Argon has a high atomic mass, which allows for effective bombardment of the target material.
When a magnetic field is present, electrons gather in the field, generating high electron density.
This increases the chance of electrons colliding with argon, accelerating the formation of positively charged argon ions (Ar+).
These ions are attracted to the negatively charged target, resulting in increased sputtering and deposition rates.
3. Cost-Effectiveness
Argon is relatively low cost and widely available in pure form.
This makes it a cost-effective option for magnetron sputtering applications.
4. Optimal Atomic Weight
The atomic weight of the gas ions used in sputtering should be similar to that of the sputtering target molecules to optimize the transfer of energy and momentum.
Argon, with its atomic weight, is well-suited for this purpose.
5. Versatility
While argon is the primary gas chosen for sputtering, other rare gas elements like krypton and xenon may also be used occasionally, depending on the specific requirements of the thin film being deposited.
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