sputtering targets

Sputtering targets are thin discs or sheets of material used in the sputtering process to deposit thin films onto a substrate. The process involves bombarding the target with ions, which eject atoms of the target material and deposit them onto the substrate. Sputtering targets have wide-ranging applications in microelectronics, optoelectronics, thin film solar cells, and decorative coatings. These targets are available in various shapes and sizes, and their effectiveness depends on their composition and ionization. Overall, sputtering targets play a crucial role in creating precision products in various fields, owing to their ability to deposit thin films of materials onto various substrates with high uniformity.

We offer the best solutions for sputtering targets, with an extensive portfolio of standard sizes and purities to meet your specific requirements. Our bespoke design service allows us to meet almost any customer requirement, ensuring that we provide you with a quality solution that exceeds your expectations. Our manufacturing processes are critical to achieve the desired characteristics in a sputter deposited thin film. To prevent the target from cracking or over-heating, we strongly recommend bonding any material target to a backing plate.

Applications of Sputtering Targets

Microelectronics: Sputtering targets are used to deposit thin films of materials such as aluminum, copper, and titanium onto silicon wafers to create electronic devices such as transistors, diodes, and integrated circuits.
Thin Film Solar Cells: Sputtering targets are used to deposit thin films of materials such as cadmium telluride, copper indium gallium selenide, and amorphous silicon onto a substrate to create solar cells with high efficiency.
Optoelectronics: Sputtering targets are used to deposit thin films of materials such as indium tin oxide and aluminum zinc oxide onto a substrate to create transparent conductive coatings for LCD displays and touch screens.
Decorative Coatings: Sputtering targets are used to deposit thin films of materials such as gold, silver, and chrome onto a variety of substrates to create decorative coatings for automotive parts, jewelry, and other products.
Aerospace and Defense: Sputtering targets are used in the fabrication of electronic and optical components for satellites, missiles, and other defense-related applications.
Medical Devices: Sputtering targets are used to deposit thin films of materials onto medical devices such as stents, pacemakers, and implantable sensors to enhance their biocompatibility and performance.
Wear-resistant Coatings: Sputtering targets are used to deposit wear-resistant coatings onto cutting tools, molds, and other industrial components to improve their durability and performance.

Advantages of Sputtering Targets

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
Most sputtering target materials can be fabricated into a wide range of shapes and sizes, including circular, rectangular, square, and triangular designs.
The manufacturing process to fabricate the sputtering target is critical to achieve the desired characteristics in a sputter deposited thin film.
Metal sputtering targets are offered in various purity levels to suit specific requirements, with the minimum purity of 99.5% up to 99.9999% for some metals.
Compound sputtering targets offer a wide selection of compounds, including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.
To prevent the sputtering target from cracking or overheating, it is strongly recommended to bond any material target to a backing plate.
Compared to planar targets, rotary targets generally have more surface area per given length, resulting in a lower cost of ownership and more material available for sputtering.
Rotary targets have much more surface area, helping keep the target running cooler, decreasing nodule formation, and reducing the occurrence of arcing.
Rotary sputtering decreases nodule formation, allowing for longer continuous runtimes and increasing target utilization to ~80%.
Rotary targets are well suited for continuous sputtering processes, increasing throughput and decreasing scrap.

Our Sputtering Targets are not only affordable but also incredibly customizable, ensuring that you receive the exact product you need for your specific application. Our products are made using various fabrication methods that are suitable for any target material and its application. Additionally, we offer a wide range of standard target sizes, shapes, and purity levels to suit your requirements. We also welcome custom design requests, ensuring that you have complete control over the specifications of your sputtering targets.

FAQ

What is sputtering target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

How are sputtering targets made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What is sputtering target used for?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What are sputtering targets for electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

What is the lifetime of a sputtering target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.

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Applications of Sputtering Targets

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