Sputtering targets are categorized into metal, alloy, and ceramic types, each serving specific purposes in the deposition of thin films. These targets can be shaped into various forms, including traditional rectangular or circular shapes, and more specialized forms like rotational targets.
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Metal Sputtering Targets: These are made from pure metallic elements. They are commonly used in applications where the purity of the metal is crucial, such as in the production of semiconductors and computer chips. The metal targets can be any elemental metal that is suitable for the desired thin film properties.
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Alloy Sputtering Targets: These targets are made from mixtures of metals. Alloys are chosen to achieve specific properties in the thin films, such as increased hardness, improved conductivity, or enhanced corrosion resistance. The composition of the alloy can be tailored to meet the specific requirements of the application.
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Ceramic Sputtering Targets: These targets are made from non-metallic compounds, typically oxides or nitrides. Ceramic targets are used to create thin films with high hardness and wear resistance, making them suitable for applications in tools and cutting instruments. The ceramic materials often provide thermal and electrical insulation properties.
The shapes of sputtering targets have evolved from traditional forms to more specialized shapes. For instance, rotational targets are cylindrical and designed to provide more precise thin film deposition. These targets have a larger surface area, which allows for faster deposition rates. The ability to customize the shape of sputtering targets enables better adaptation to specific deposition systems and requirements.
In summary, sputtering targets are essential components in the sputter deposition process, where they provide the material source for thin film creation. The choice of target type (metal, alloy, or ceramic) and shape depends on the specific application and the desired properties of the thin film.
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