Sputtering targets are essential components in the sputter deposition process. They provide the material source for thin film creation.
4 Key Types of Sputtering Targets You Need to Know
Metal Sputtering Targets
Metal sputtering targets are made from pure metallic elements. They are commonly used in applications where the purity of the metal is crucial. This includes the production of semiconductors and computer chips. The metal targets can be any elemental metal that is suitable for the desired thin film properties.
Alloy Sputtering Targets
Alloy sputtering targets are made from mixtures of metals. Alloys are chosen to achieve specific properties in the thin films. These properties include increased hardness, improved conductivity, or enhanced corrosion resistance. The composition of the alloy can be tailored to meet the specific requirements of the application.
Ceramic Sputtering Targets
Ceramic sputtering targets are made from non-metallic compounds. These compounds are typically oxides or nitrides. Ceramic targets are used to create thin films with high hardness and wear resistance. This makes them suitable for applications in tools and cutting instruments. The ceramic materials often provide thermal and electrical insulation properties.
Specialized Shapes of Sputtering Targets
The shapes of sputtering targets have evolved from traditional forms to more specialized shapes. For instance, rotational targets are cylindrical and designed to provide more precise thin film deposition. These targets have a larger surface area, which allows for faster deposition rates. The ability to customize the shape of sputtering targets enables better adaptation to specific deposition systems and requirements.
Continue exploring, consult our experts
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