In sputtering, the target is a solid piece of material that is used to deposit a thin film onto a substrate. This process involves the ejection of atoms or molecules from the target material due to bombardment by energetic particles, typically ions of an inert gas like argon. The sputtered material then forms a film on the substrate placed within the vacuum chamber.
Target Characteristics and Types: The targets in sputtering systems are typically solid slabs of various sizes and shapes, ranging from flat to cylindrical depending on the specific requirements of the plasma geometry. These targets are made from a variety of materials including pure metals, alloys, and compounds such as oxides or nitrides. The choice of target material depends on the desired properties of the thin film to be deposited.
Sputtering Process: During the sputtering process, a controlled gas, usually argon, is introduced into a vacuum chamber. An electrical discharge is applied to the cathode, which houses the target material, creating a plasma. In this plasma, argon atoms are ionized and accelerated towards the target, where they collide with the target material, causing atoms or molecules to be ejected. These ejected particles form a vapor stream that travels through the chamber and deposits onto the substrate, forming a thin film.
Specific Examples and Applications: For instance, a silicon sputtering target is made from a silicon ingot and can be manufactured using various methods such as electroplating, sputtering, or vapor deposition. These targets are processed to ensure they have desirable surface conditions, such as high reflectivity and low surface roughness, which are crucial for the quality of the deposited films. The films produced by such targets are characterized by low particle counts, making them suitable for applications in semiconductor and solar cell manufacturing.
Conclusion: In summary, the target in sputtering is a critical component that determines the material composition and properties of the thin film deposited on the substrate. The process of sputtering involves the use of a plasma to eject material from the target, which then deposits onto the substrate, forming a thin film with specific desired characteristics.
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