The main types of sputtering systems used in practice include:
1. DC diode sputtering: This type of sputtering uses a DC voltage between 500-1000 V to ignite an argon low-pressure plasma between a target and a substrate. Positive argon ions precipitate atoms out of the target, which migrate to the substrate and condense to form a thin film. However, only electrical conductors can be sputtered using this method, and low sputtering rates are achieved.
Other types of sputtering processes include:
2. RF-diode sputtering: This method uses radio frequency power to ionize the gas and generate plasma. It allows for higher sputtering rates and can be used for both conductive and insulating materials.
3. Magnetron diode sputtering: In this method, a magnetron is used to enhance sputtering efficiency. The magnetic field traps electrons near the target surface, increasing the ionization rate and improving the deposition rate.
4. Ion beam sputtering: This technique involves using an ion beam to sputter atoms from the target material. It allows for precise control of the ion energy and angle of incidence, making it suitable for applications requiring high precision and uniformity.
It is important to note that sputtering can be used for a wide variety of materials, including metals, ceramics, and other materials. The sputter coatings can be single-layered or multilayered and can consist of materials like silver, gold, copper, steel, metal oxides, or nitrides. Additionally, there are different forms of sputter processes, such as reactive sputtering, high-power impulse magnetron sputtering (HiPIMS), and ion-assisted sputtering, each with their own unique characteristics and applications.
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