Sputtering is a crucial process in various industries, especially in the creation of thin films.
There are several types of sputtering systems used in practice, each with its own unique characteristics and applications.
What are the types of sputtering? (4 Key Methods Explained)
1. DC Diode Sputtering
DC diode sputtering uses a DC voltage between 500-1000 V to ignite an argon low-pressure plasma between a target and a substrate.
Positive argon ions precipitate atoms out of the target, which then migrate to the substrate and condense to form a thin film.
However, this method is limited to electrical conductors and offers low sputtering rates.
2. RF-Diode Sputtering
RF-diode sputtering employs radio frequency power to ionize the gas and generate plasma.
This method allows for higher sputtering rates and can be used for both conductive and insulating materials.
3. Magnetron Diode Sputtering
In magnetron diode sputtering, a magnetron is used to enhance sputtering efficiency.
The magnetic field traps electrons near the target surface, increasing the ionization rate and improving the deposition rate.
4. Ion Beam Sputtering
Ion beam sputtering involves using an ion beam to sputter atoms from the target material.
This technique offers precise control over ion energy and angle of incidence, making it ideal for applications requiring high precision and uniformity.
It's important to note that sputtering can be used for a wide variety of materials, including metals, ceramics, and other materials.
Sputter coatings can be single-layered or multilayered and can consist of materials like silver, gold, copper, steel, metal oxides, or nitrides.
There are also different forms of sputter processes, such as reactive sputtering, high-power impulse magnetron sputtering (HiPIMS), and ion-assisted sputtering, each with their own unique characteristics and applications.
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