Metal sputtering is a process used for depositing thin layers of metal onto a substrate.
It involves creating a high electrical field around a source material, known as the target, and using this field to generate a plasma.
The plasma removes atoms from the target material, which are then deposited onto the substrate.
7 Key Points to Understand This Process
1. Gas Plasma Discharge
During sputtering, a gas plasma discharge is set up between two electrodes: the cathode, which is made of the target material, and the anode, which is the substrate.
2. Ionization Process
The plasma discharge causes the gas atoms to become ionized and form positively charged ions.
3. Acceleration of Ions
These ions are then accelerated towards the target material, where they strike with enough energy to dislodge atoms or molecules from the target.
4. Formation of Vapor Stream
The dislodged material forms a vapor stream, which travels through the vacuum chamber and eventually reaches the substrate.
5. Deposition of Thin Film
As the vapor stream hits the substrate, the atoms or molecules of the target material stick to it, creating a thin film or coating.
6. Versatility of Sputtering
Sputtering is a versatile technique that can be used to deposit coatings of conductive or insulating materials.
7. Applications in Various Industries
It can be used to deposit coatings of very high chemical purity onto essentially any substrate, making sputtering suitable for a wide range of applications in industries such as semiconductor processing, precision optics, and surface finishing.
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