Sputter deposition is a method used in semiconductor manufacturing for depositing thin films onto a substrate, such as a silicon wafer.
It is a type of physical vapor deposition (PVD) technique that involves ejecting material from a target source and depositing it onto the substrate.
10 Key Points to Know About Sputter Deposition
1. Magnetron System
In sputter deposition, a diode plasma system known as a magnetron is typically used.
The system consists of a cathode, which is the target material, and an anode, which is the substrate.
2. Ion Bombardment
The cathode is bombarded with ions, causing atoms to be ejected or sputtered from the target.
3. Reduced Pressure Region
These sputtered atoms then travel through a region of reduced pressure and condense onto the substrate, forming a thin film.
4. Uniform Thickness
One of the advantages of sputter deposition is that it allows for the deposition of thin films with uniform thickness over large wafers.
This is because it can be achieved from large-size targets.
5. Thickness Control
The thickness of the film can be easily controlled by adjusting the deposition time and fixing the operating parameters.
6. Alloy Composition Control
Sputter deposition also offers control over the alloy composition, step coverage, and grain structure of the thin film.
7. Sputter-Cleaning
It allows for sputter-cleaning of the substrate in vacuum before deposition, which helps in achieving high-quality films.
8. Avoids Device Damage
Additionally, sputtering avoids device damage from X-rays generated by electron beam evaporation.
9. Process Steps
The process of sputtering involves several steps. First, ions are generated and directed at the target material. These ions sputter atoms from the target.
The sputtered atoms then travel to the substrate through a region of reduced pressure.
Finally, the sputtered atoms condense on the substrate, forming a thin film.
10. Versatility and Reliability
Sputter deposition is a widely used and proven technology in semiconductor manufacturing.
It can deposit thin films from a variety of materials onto different substrate shapes and sizes.
The process is repeatable and can be scaled up for production batches involving medium to large substrate areas.
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