MPCVD
Drawing die nano-diamond coating HFCVD Equipment
Item Number : MP-CVD-100
Price varies based on specs and customizations
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Application
HFCVD chemical vapor deposition of diamond working principle is: mix a carbon-containing atmosphere with supersaturated hydrogen, activate it in a certain way, and then pass it through a certain atmosphere composition, activation energy, substrate temperature, and the distance between the substrate and the activation source, etc. Under these conditions, a diamond film is deposited on the bottom surface. It is generally believed that the nucleation and growth of diamond films can be divided into three stages:
- Carbon-containing gas and radon gas decompose into carbon, hydrogen atoms and other active free groups at a certain temperature. They combine with the matrix to first form a very thin carbide transition layer.
- Carbon atoms deposit diamond nuclei on the transition layer formed on the substrate.
- The formed diamond crystal nucleus grows into a diamond micro-item under a suitable environment, and then grows into a diamond film.
Detail & Parts
Technical specifications
HFCVD technical composition | ||
Technical Parameters | Equipment composition | System Configuration |
Bell Jar: Dia. 500mm, Height 550mm, SUS304 stainless steel chamber; inner stainless steel skin insulation, lifting height is 350mm; | A set of vacuum chamber (bell jar) main body (jacketed water-cooling structure) | Vacuum chamber (bell jar) main body;The cavity is made of high-quality 304 stainless steel; Vertical bell jar: the jacketed water-cooling jacket is installed on the overall periphery of the bell jar. The inner wall of the bell jar is insulated with stainless steel skin, and the bell jar is fixed on the side . Accurate and stable positioning ; Observation window: horizontally arranged in the middle of the vacuum chamber 200mm Observation window, water cooling, baffle, side and upper configuration 45 Degree bevel angle, 50° observation window (observe the same point as the horizontal observation window, and the sample supporting platform); the two observation windows maintain the existing position and size.Bell jar bottom is 20mm higher than the plane of the bench , set cooling; the holes reserved on the plane, such as large valves, air release valves, air pressure measurement, bypass valves, etc., are sealed with metal mesh and reserved for installing electrodes Interface; |
Equipment table: L1550* W900*H1100mm | One set of drag sample table device (adopting double-axis drive ) | Sample holder device: Stainless steel sample holder (welding water cooling ) 6- position device; it can be adjusted separately, only up and down adjustment, the up and down adjustment range is 25mm, and the left and right shaking is required to be less than 3% when going up and down ( that is, the left and right shaking of rising or falling by 1mm is less than 0.03mm ) , and the sample stage does not rotate when rising or falling. |
Ultimate vacuum degree: 2.0×10-1Pa ; | A set of vacuum system | Vacuum system: Vacuum system configuration: mechanical pump + vacuum valve + physical bleed valve + main exhaust pipe + bypass; (provided by the vacuum pump supplier), the vacuum valve uses a pneumatic valve; Vacuum system measurement: Membrane pressure. |
Pressure rise rate : ≤5Pa/h; | Two channels mass flow meter gas supply system | Gas supply system: The mass flow meter is configured by Party B, two-way air intake, the flow rate is controlled by the mass flow meter, after the two-way meeting, it enters the vacuum chamber from the top , and the inside of the air intake pipe is 50mm |
Sample table movement: up and down range is ± 25m; it is required to shake left and right ratio when up and down by ± 3%; | One set of electrode device (2 channels) | Electrode device: The length direction of the four electrode holes is parallel to the length direction of the support platform, and the length direction is facing the main observation window with a diameter of 200mm . |
Working pressure: use membrane gauge pressure gauge, measuring range: 0 ~ 10kPa; work constant at 1kPa ~5kPa,the constant pressure value changes plus or minus 0.1kPa; | A set of cooling water system | Cooling water system: The bell jar, electrodes, and bottom plate are all equipped with circulating water cooling pipelines, and are equipped with insufficient water flow alarm device 3.7: control system. Switches, instruments, instruments and power supply for bell lifting, deflation, vacuum pump, main road, bypass, alarm, flow, air pressure, etc. are set on the side of the stand, and are controlled by a 14 -inch touch screen; the equipment has a fully automatic control program without manual intervention, and can store data and call data |
Air intake position: air intake at the top of the bell jar, and the position of the exhaust port is located directly below the sample holder; | Control system | |
Control System: PLC controller + 10-inch touch screen | A set of automatic pressure control system (original pressure control valve imported from Germany ) | |
Inflation system: 2 channels mass flow meter, flow range: 0-2000sccm and 0-200sccm; Pneumatic valve valve | Resistance Vacuum Gauge | |
3.1.10 Vacuum pump: D16C vacuum pump |
Advantages
The nano-diamond composite coating drawing die uses cemented carbide (WC-Co) as the substrate, and uses the chemical vapor phase method ( CVD method for short ) to coat the conventional diamond and nano-diamond composite coating on the surface of the inner hole of the mold. And a brand new product obtained after grinding and polishing the coating . The nano-diamond composite coating coated on the surface of the inner hole not only has the characteristics of strong adhesion and wear resistance of the conventional diamond coating, but also has the advantages of flat and smooth surface of the nano-diamond coating, small friction coefficient and easy grinding and polishing. Coating technology not only solves the technical problem of coating adhesion, but also breaks through the bottleneck that the surface of diamond coating is not easy to polish, and removes the obstacles to the industrialization of CVD diamond film.
Technical indicators |
Traditional drawing die |
Nano-diamond coated drawing die |
Coating Surface Grain Size |
none |
20~80nm |
Coating diamond content |
none |
≥99% |
Diamond Coating Thickness |
none |
10 ~ 15mm |
Surface roughness |
Ra≤0.1mm |
Class A: Ra≤0.1mm Class B: Ra≤0.05mm |
Coating drawing die inner hole diameter range |
Ф3 ~ Ф70mm |
Ф3 ~ Ф70mm |
Service life span |
Life span depends on working conditions |
6-10 times longer |
Surface friction coefficient |
0.8 |
0.1 |
- For the parallelism and straightness of the mold lifting platform of the equipment, our company has specially produced special tooling. The biaxial lifting method is enough to allow the two ends to be raised and lowered by about ±2 wires, so that smaller molds can be made.
- For the tooling of the equipment, our company integrates the location of each company on the tooling, aiming at the tooling and process of the mold. Good tooling and clamping, stable and reliable, high precision, easy to operate.
- For the shut-off valve of the equipment, other manufacturers use baffle valves, which cannot be adjusted linearly (that is, the gap increases quickly as soon as it is opened). Our company designs it according to the principle of the shut-off valve and stable pressure control, so that the shut-off gap can be linearly adjusted to achieve Stable pressure control;
- The fully automatic control system automatically controls the pressure according to computer algorithms; it can reduce the operator's randomness and make the process more confidential. It saves labor, and the consistency of mold quality of the same specifications is more ideal;
- For the stability of the lifting bell jar, our company uses self-lubricating bearings, which make the rotation more flexible and free of jamming. Basic process, diamond coating can be made according to each customer's diamond coating process.
Warnings
Operator safety is the top important issue! Please operate the equipment with cautions. Working with inflammable& explosive or toxic gases is very dangerous, operators must take all necessary precautions before starting the equipment. Working with positive pressure inside the reactors or chambers is dangerous, operator must fellow the safety procedures strictly. Extra caution must also be taken when operating with air-reactive materials, especially under vacuum. A leak can draw air into the apparatus and cause a violent reaction to occur.
Designed for You
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FAQ
What Materials Can A Diamond Cutting Machine Cut?
What Is CVD (Chemical Vapor Deposition) And What Are Its Key Advantages?
What Is CVD Furnace?
Chemical vapor deposition (CVD) is a technology that uses various energy sources such as heating, plasma excitation or light radiation to chemically react gaseous or vapor chemical substances on the gas phase or gas-solid interface to form solid deposits in the reactor by means of chemical reaction.To put it simply, two or more gaseous raw materials are introduced into a reaction chamber, and then they react with each other to form a new material and deposit it on the substrate surface.
CVD furnace is one combined furnace system with high temperature tube furnace unit,gases control unit, and vacuum unit, it is widely used for experiment and production of composite material preparation, microelectronics process, semiconductor optoelectronic, solar energy utilization, optical fiber communication, superconductor technology, protective coating field.
What Is Physical Vapor Deposition (PVD)?
What Is CVD Diamond Machine?
What Types Of Diamond Growth Machines Are Available?
What Is The Principle Behind A Diamond Cutting Machine?
What Are The Methods Used To Deposit Thin Films?
What Are Some Common Applications Of CVD Materials?
What Is The Basic Principle Of CVD?
How Does CVD Furnace Work?
CVD furnace system consists of high temperature tube furnace unit, reacting gas source precise control unit, vacuum pump station and corresponding assembling parts.
Vacuum pump is to remove the air from the reacting tube,and make sure there is no unwanted gases inside the reaction tube, after that the tube furnace will heat the reaction tube to a target temperature, then reacting gas source precise control unit can introduce different gases with a set ratio into the furnace tube for the chemical reaction, the chemical vapor deposition will be formed in the CVD furnace.
What Is Mpcvd?
What Is RF PECVD?
What Is PECVD Method?
What Is Magnetron Sputtering?
How Does A CVD Diamond Machine Work?
What Are The Advantages Of Lab Grown Diamonds?
What Are The Advantages Of Using A Diamond Cutting Machine?
What Is Thin Film Deposition Equipment?
What Types Of CVD Materials Are Available?
What Are The Different Types Of CVD Method?
Which Gas Is Used In CVD Process?
There are tremendous gas sources can be used in the CVD process, the common chemical reactions of CVD includes Pyrolysis, photolysis, reduction, oxidation, redox,so the gases involved in these chemical reactions can be used in the CVD process.
We take CVD Graphene growth for an example, the gases used in the CVD process will be CH4,H2,O2 and N2.
What Is Mpcvd Machine?
How Does RF PECVD Work?
What Is PECVD Used For?
Why Magnetron Sputtering?
What Are The Advantages Of Using CVD Diamond Machines?
What Is The Price Of CVD Growing Machine?
What Types Of Diamond Cutting Machines Are Available?
What Is Thin-film Deposition Technology?
How Does CVD Diamond Enhance The Performance Of Cutting Tools?
What Are The Advantages Of Using Chemical Vapor Deposition Machines?
What Is The Advantage Of CVD System?
- Wide range of films can be produced, metal film, nonmetal film and multi-component alloy film as required. At the same time, it can prepare high-quality crystals that are difficult to obtain by other methods, such as GaN, BP, etc.
- The film forming speed is fast, usually several microns per minute or even hundreds of microns per minute. It is possible to simultaneously deposit large quantities of coatings with uniform composition, which is incomparable to other film preparation methods, such as liquid phase epitaxy (LPE) and molecular beam epitaxy (MBE).
- The working conditions are carried out under normal pressure or low vacuum conditions, so the coating has good diffraction, and the workpieces with complex shapes can be uniformly coated, which is much superior to PVD.
- Due to the mutual diffusion of reaction gas, reaction product and substrate, a coating with good adhesion strength can be obtained, which is crucial for preparing surface strengthened films such as wear-resistant and anti-corrosion films.
- Some films grow at a temperature far lower than the melting point of the film material. Under the condition of low temperature growth, the reaction gas and reactor wall and impurities contained in them almost do not react, so a film with high purity and good crystallinity can be obtained.
- Chemical vapor deposition can obtain a smooth deposition surface. This is because compared with LPE, chemical vapor deposition (CVD) is carried out under high saturation, with high nucleation rate, high nucleation density, and uniform distribution on the whole plane, resulting in a macroscopic smooth surface. At the same time, in chemical vapor deposition, the average free path of molecules (atoms) is much larger than LPE, so the spatial distribution of molecules is more uniform, which is conducive to the formation of a smooth deposition surface.
- Low radiation damage, which is a necessary condition for manufacturing metal oxide semiconductors (MOS) and other devices
What Are The Advantages Of Mpcvd?
What Are The Advantages Of RF PECVD?
What Are The Advantages Of PECVD?
What Are The Materials Used In Thin Film Deposition?
Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.
The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.
What Considerations Should Be Made When Selecting A CVD Diamond Machine?
How Does A Diamond Cutting Machine Ensure High Precision Cutting?
What Are The Advantages Of Using Thin Film Deposition Equipment?
What Makes CVD Diamond Domes Suitable For High-performance Loudspeakers?
What Are The Applications Of Chemical Vapor Deposition Machines?
What Does PECVD Stand For?
PECVD is a technology that uses plasma to activate reaction gas, promote chemical reaction on the surface of substrate or near surface space, and generate solid film. The basic principle of plasma chemical vapor deposition technology is that under the action of RF or DC electric field, the source gas is ionized to form a plasma, the low-temperature plasma is used as the energy source, an appropriate amount of reaction gas is introduced, and the plasma discharge is used to activate the reaction gas and realize chemical vapor deposition.
According to the method of generating plasma, it can be divided into RF plasma, DC plasma and microwave plasma CVD, etc...
Are CVD Diamonds Real Or Fake?
What Is The Difference Between ALD And PECVD?
What Are The Methods To Achieve Optimal Thin Film Deposition?
To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.
The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.
To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.
Uses Of Thin Film Deposition
Zinc Oxide-Based Thin Films
ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.
Thin-Film Resistors
Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.
Magnetic Thin Films
Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.
Optical Thin Films
Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.
Polymer Thin Films
Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.
Thin-Film Batteries
Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.
Thin-Film Coatings
Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.
Thin-Film Solar Cells
Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.
What Are The Common Applications Of Diamonds Produced By CVD Diamond Machines?
What Is The Application Range Of A Diamond Cutting Machine?
What Factors Should Be Considered When Selecting Thin Film Deposition Equipment?
How Does CVD Diamond Improve Thermal Management In Electronic Devices?
What Factors Should Be Considered When Selecting A Chemical Vapor Deposition Machine?
What Is The Difference Between CVD And PECVD?
The difference between PECVD and traditional CVD technology is that the plasma contains a large number of high-energy electrons, which can provide the activation energy required in the chemical vapor deposition process, thus changing the energy supply mode of the reaction system. Since the electron temperature in the plasma is as high as 10000K, the collision between electrons and gas molecules can promote the chemical bond breaking and recombination of the reaction gas molecules to generate more active chemical groups, while the whole reaction system maintains a lower temperature.
So compared to the CVD process, PECVD can carry out the same chemical vapor deposition process with a lower temperature.
What Is The Difference Between PECVD And Sputtering?
Factors And Parameters That Influence Deposition Of Thin Films
Deposition Rate:
The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.
Uniformity:
The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.
Fill Capability:
Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.
Film Characteristics:
The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.
Process Temperature:
Film characteristics are significantly affected by process temperature, which may be limited by the application.
Damage:
Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.
What Safety Considerations Are Associated With Operating Thin Film Deposition Equipment?
Can Chemical Vapor Deposition Machines Be Used For Multi-layered Thin Film Deposition?
4.8
out of
5
The HFCVD Equipment is a game-changer in diamond coating technology. It's efficient, precise, and delivers superior results. Highly recommended!
4.9
out of
5
I'm thoroughly impressed with the quality and performance of the HFCVD Equipment. It has significantly improved our diamond coating process, resulting in exceptional results. A must-have for any lab!
4.7
out of
5
The HFCVD Equipment has exceeded my expectations. It's user-friendly, reliable, and produces high-quality diamond coatings consistently. A valuable addition to our laboratory.
4.9
out of
5
The HFCVD Equipment is a technological marvel. It has revolutionized our diamond coating research, enabling us to achieve remarkable results. Highly recommended for advanced materials research.
4.8
out of
5
The HFCVD Equipment has transformed our laboratory's capabilities. It delivers exceptional diamond coatings with remarkable precision and efficiency. A valuable investment for any research institution.
4.7
out of
5
I'm highly satisfied with the HFCVD Equipment. It has significantly improved our diamond coating process, resulting in enhanced product quality and reduced production time. Highly recommended!
4.9
out of
5
The HFCVD Equipment is a testament to cutting-edge technology. It has enabled us to achieve unprecedented results in diamond coating, opening up new possibilities for research and innovation.
4.8
out of
5
The HFCVD Equipment has proven to be an invaluable asset to our laboratory. It delivers consistent, high-quality diamond coatings, making it an essential tool for our research.
4.7
out of
5
I'm thoroughly impressed with the HFCVD Equipment. It's user-friendly, efficient, and produces exceptional diamond coatings. A must-have for any laboratory involved in materials research.
4.9
out of
5
The HFCVD Equipment is a remarkable piece of technology. It has enabled us to achieve breakthrough results in diamond coating, pushing the boundaries of materials science.
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