The range of sputtering can be understood through the energy distribution of sputtered atoms and the modes of their transport from the target to the substrate. Sputtered atoms typically have energies ranging up to several tens of electron volts (eV), which is equivalent to temperatures of 100,000 K. This high energy allows these atoms to travel ballistically from the target in straight lines, impacting substrates or the vacuum chamber with significant energy. This can lead to resputtering, where the impacted material is ejected again.
At higher gas pressures, the sputtered atoms may collide with gas atoms, which act as moderators. These collisions result in the atoms losing energy and transitioning to a diffusive motion. This motion involves a random walk, eventually leading the atoms to condense on the substrates or vacuum chamber walls. The transition from ballistic to diffusive motion is influenced by the background gas pressure, allowing a wide range of energy states to be accessed during the sputtering process.
The choice of sputtering gas also affects the range and efficiency of the sputtering process. Inert gases like argon are commonly used due to their chemical stability. For sputtering light elements, neon is sometimes used, while for heavier elements, krypton or xenon may be chosen to better match the target mass and enhance momentum transfer. Reactive gases can be used when sputtering compounds, allowing chemical reactions to occur on the target surface, in-flight, or on the substrate, depending on process parameters.
The complexity of sputter deposition, with its many controllable parameters, provides a high degree of control over the growth and microstructure of the deposited film. This makes sputtering a versatile and precise method for depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
In summary, the range of sputtering encompasses a spectrum from high-energy ballistic impacts to low-energy thermalized motion, controlled by factors such as gas pressure, choice of sputtering gas, and process parameters. This range allows for precise control over the deposition process, making sputtering a valuable tool in materials science and technology.
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