To clean a sputter target, you can follow the steps below:
1. Clean with a soft lint-free cloth soaked in acetone. This will help remove any dust or dirt that may be present on the surface of the target.
2. Clean with alcohol. Use a clean cloth soaked in alcohol to further clean the target and remove any remaining contaminants.
3. Clean with deionized water. Rinse the target with deionized water to ensure that all traces of acetone and alcohol are removed.
4. Dry the target. After cleaning with deionized water, place the target in an oven and dry it at a temperature of 100 ℃ for 30 minutes. This will ensure that the target is completely dry before further use.
In addition to the cleaning process, there are some precautions to keep in mind during the use of sputter coater targets:
1. Sputter preparation: It is important to keep the vacuum chamber and the sputtering system clean. Any residue or contaminants can increase the possibility of film failure. Clean the sputtering chambers, sputter guns, and sputtering targets to avoid system short circuits, target arcing, and rough surface formation.
2. Target installation: During target installation, ensure a good thermal connection between the target and the stabilizing wall of the sputter gun. If the cooling stave or backing plate is warped, it can cause cracking or bending of the target, affecting the thermal conductivity and leading to target damage.
3. Optimizing target usage: In sputtering systems, the target is a solid piece of material that will be sputtered for thin film coating. Ensure that the target is large enough to avoid unintended sputtering of other components. Pay attention to areas on the target surface where the sputtering effect has been predominant, known as race tracks, as they may need to be addressed or replaced.
4. Silicon Sputtering Target: If you are working with a silicon sputtering target, it is important to choose a target that is manufactured using appropriate processes and methods. This can include electroplating, sputtering, and vapor deposition. Additionally, cleaning and etching processes may be necessary to achieve desirable surface conditions.
By following these steps and taking precautions, you can effectively clean and use sputter targets in your sputtering process.
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