The limitations of sputtering include difficulties in combining with lift-off for structuring the film due to diffuse transport, challenges in active control for layer-by-layer growth, and the incorporation of inert sputtering gases as impurities in the film. Additionally, sputtering can lead to film contamination, requires a cooling system which affects production rate and energy costs, and does not allow for accurate control of film thickness. The process also involves high capital expenses, low deposition rates for some materials, and degradation of certain materials by ionic bombardment.
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Difficulty in Combination with Lift-Off: Sputtering's characteristic diffuse transport makes it challenging to fully shadow areas, leading to difficulties in structuring the film precisely. This diffuse nature of the sputtered atoms means they can land in unwanted areas, potentially causing contamination and issues with the desired patterning of the film.
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Challenges in Active Control for Layer-by-Layer Growth: Compared to techniques like pulsed laser deposition, sputtering lacks the precision needed for active control over layer-by-layer growth. This can affect the quality and properties of the deposited film, particularly in applications requiring very precise and controlled layering.
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Incorporation of Impurities: Inert sputtering gases can become incorporated into the growing film as impurities. This can alter the properties of the film, potentially degrading its performance in specific applications.
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Film Contamination and Cooling System Requirements: Sputtering can lead to contamination from evaporated impurities, and the need for a cooling system increases energy costs and reduces production rates. This cooling is necessary due to the heat generated during the sputtering process, which can affect the substrate and the quality of the deposited film.
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High Capital Expenses and Low Deposition Rates: The equipment for sputtering is expensive, and the deposition rates for some materials, like SiO2, are relatively low. This can make the process less economically viable for certain applications.
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Material Degradation: Certain materials, particularly organic solids, can be degraded by the ionic bombardment inherent in the sputtering process. This limits the types of materials that can be effectively used with sputtering.
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Inaccurate Control of Film Thickness: While sputtering allows for high deposition rates without a limit on thickness, it does not provide accurate control over the thickness of the film. This can be a significant drawback in applications requiring precise thickness control.
These limitations highlight the need for careful consideration of the sputtering process in relation to specific application requirements and material properties.
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