To clean a sputtering target, follow these steps:
Step 1: Clean with a soft lint-free cloth soaked in acetone. This will help remove any dust or dirt that may be present on the surface of the target.
Step 2: Clean with alcohol. This step further helps in removing any contaminants or residues on the target.
Step 3: Clean with deionized water. Deionized water is used to ensure that any remaining impurities or residues are thoroughly removed from the target.
Step 4: After cleaning with deionized water, place the target in the oven and dry at 100 ℃ for 30 minutes. This step is important to ensure that the target is completely dry before further use.
In addition to cleaning the sputtering target, there are also some precautions to be taken during the sputtering process:
1. Sputter preparation: It is important to keep the vacuum chamber and sputtering system clean. Any residues or contaminants can increase the possibility of film failure or system short circuits.
2. Target installation: Ensure a good thermal connection between the target and the stabilizing wall of the sputter gun. If the cooling stave or backing plate is warped, it can affect the thermal conductivity and lead to cracking or bending of the target.
3. Maintain sputtering gas cleanliness: The sputtering gas, such as argon or oxygen, should be clean and dried to maintain the composition characteristics of the coating.
Overall, cleaning and maintaining the sputtering target is crucial for achieving high-quality thin film deposition and preventing any potential issues during the sputtering process.
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