The thickness of sputtered gold can vary depending on the specific conditions of the sputtering process, but it is typically very thin, often measured in nanometers. The formula provided in the reference suggests that the thickness (Th) of an Au/Pd coating sputtered in argon gas can be calculated using the equation Th = 7.5 I t, where I is the current in mA and t is the time in minutes. For example, using a current of 20 mA and a time of 2-3 minutes, the thickness would be approximately 300-450 angstroms (3-4.5 nm).
Explanation:
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Sputtering Process: Gold sputtering involves the deposition of gold atoms onto a substrate in a vacuum chamber. High-energy ions bombard a gold target, causing gold atoms to be ejected and deposited onto the substrate. The thickness of the deposited gold layer depends on the intensity of the ion bombardment, the distance between the target and the substrate, and the duration of the sputtering process.
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Thickness Calculation: The formula Th = 7.5 I t is specific to the conditions mentioned (2.5KV voltage, 50mm target to specimen distance). It calculates the thickness in angstroms, where 1 angstrom equals 0.1 nanometers. Therefore, a 300-450 angstrom coating would be equivalent to 30-45 nm of gold.
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Application Considerations: Gold is not ideal for high-magnification imaging due to its high secondary electron yield and the formation of large islands or grains during sputtering. This can affect the visibility of surface details at high magnifications. However, for applications requiring low magnifications or specific functional properties (e.g., conductivity, corrosion resistance), gold sputtering is effective and commonly used.
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Variability in Deposition Rates: The reference also mentions that platinum targets, when used, typically result in approximately half the deposition rate of other materials. This implies that similar settings for sputtering platinum might yield a thinner coating compared to gold.
In summary, the thickness of sputtered gold is highly dependent on the sputtering parameters and can range from a few nanometers to tens of nanometers, depending on the specific application and the conditions set during the sputtering process.
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