The function of a sputter coater is to apply a very thin, functional coating on a substrate. In the case of scanning electron microscopy (SEM), sputter coating is used to prepare samples for analysis by depositing a thin layer of metal, such as gold or platinum, onto the sample. This process helps improve conductivity, reduce electric charging effects, and provide structural protection against the electron beam.
Sputter coating involves generating a metal plasma that is deposited on the sample in a controlled manner. The target material, bonded or clamped to the cathode, is electrically charged to form a plasma, causing material to be ejected from the target surface. Magnets are used to ensure stable and uniform erosion of the material. The high energy target material impacts the substrate, forming a very strong bond at an atomic level. This means that the coated material becomes a permanent part of the substrate, rather than just a surface coating.
The advantages of sputter coating include improved conductivity, reduced charging effects, and enhanced secondary electron emission. The stable plasma created during the process ensures a more uniform deposition, resulting in a consistent and durable coating. Sputter coating is commonly used in various applications such as solar panels, architectural glass, microelectronics, aerospace, flat panel displays, and automotive industries.
Overall, the function of a sputter coater is to provide an electrically conductive thin film representative of the specimen to be viewed in scanning electron microscopy. This film inhibits charging, reduces thermal damage, and enhances secondary electron emission.
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