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Electron Beam Evaporation Coating Oxygen-Free Copper Crucible

Thin Film Deposition Parts

Electron Beam Evaporation Coating Oxygen-Free Copper Crucible

Item Number : KMS06

Price varies based on specs and customizations

Material
Oxygen-free copper
Specification
35-50*17-25mm
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Introduction

Electron Beam Evaporation Coating Oxygen-Free Copper Crucible is a type of laboratory equipment used for the deposition of thin films. It uses an electron beam to vaporize a material, which is then deposited on a substrate. This process is used to create thin films of metals, dielectrics, and other materials.

The Electron Beam Evaporation Coating Oxygen-Free Copper Crucible is made of oxygen-free copper, which has a high thermal conductivity and is resistant to oxidation. This makes it ideal for use in high-temperature applications. The crucible is also water-cooled to prevent it from overheating.

The Electron Beam Evaporation Coating Oxygen-Free Copper Crucible is a versatile piece of equipment that can be used for a variety of applications. It is commonly used in the semiconductor industry, but it can also be used in other industries, such as the optical and medical industries.

Application

Electron beam evaporation coating refers to the process of using electron beams to evaporate materials in the process of thin film deposition, and then condense them on the substrate to form a thin film. When using electron beam evaporation techniques, use oxygen-free copper crucibles to maintain an oxygen-free or oxygen-depleted environment to minimize the risk of oxygen contamination during evaporation. This helps ensure that high-quality films are deposited without unwanted chemical reactions or oxidation. Oxygen-free copper crucibles are often preferred when handling sensitive materials or depositing thin films where high purity is required.

  • Semiconductor Industry: Manufacture of integrated circuits, semiconductor devices and microelectronics.
  • Optics and Photonics: Optical coatings and films for lenses, mirrors, filters, waveguides and other optical components.
  • Solar energy: Electron beam evaporation is used to make thin film solar cells such as CIGS (copper indium gallium selenide) and CdTe (cadmium telluride) solar cells.
  • Display technology: E-beam evaporation is used to produce thin films for various types of displays, including LCD (Liquid Crystal Display), OLED (Organic Light Emitting Diode) and microdisplay technologies.
  • Manufacturing of sensors and electronics: Electron beam evaporation is used to produce thin films for sensors, electronics and integrated circuits.

Electron beam evaporation coating oxygen-free copper crucible details

Electron beam evaporation coating oxygen-free copper crucible detail 1

Electron beam evaporation coating oxygen-free copper crucible detail 2

Electron beam evaporation coating oxygen-free copper crucible detail 3

Technical specifications

Outer diameter & High 35*17mm 40*17mm 45*22mm 50*25mm

The crucibles we show are available in different sizes and custom sizes are available on request.

Features 

Electron Beam Evaporation Coating Oxygen-Free Copper Crucible features a four-pocket hearth that can contain up to four source materials, allowing for the sequential deposition of four material layers without breaking the vacuum. This makes it easy to apply several different layers of coating from different target materials, adapting easily to a variety of lift-off masking techniques.

The crucible is water-cooled to prevent it from heating through thermal energy, and directly heating the source materials eliminates the risk of heat damage to the substrate. This makes E-Beam Evaporation ideal for applications where high temperatures and wear resistance are key, such as in the aerospace, automotive, and cutting tool industries.

E-Beam Evaporation is also used for optical thin films ranging from laser optics, solar panels, eye glasses and architectural glass to give them the desired conductive, reflective and transmissive qualities.

FAQ

What are thermal evaporation sources?

Thermal evaporation sources are devices used in thermal evaporation systems to deposit thin films onto substrates. They work by heating a material (evaporant) to high temperatures, causing it to evaporate and then condense onto a substrate, forming a thin film.

What is Physical vapor deposition (PVD)?

Physical vapor deposition (PVD) is a technique for depositing thin films by vaporizing a solid material in a vacuum and then depositing it onto a substrate. PVD coatings are highly durable, scratch-resistant, and corrosion-resistant, making them ideal for a variety of applications, from solar cells to semiconductors. PVD also creates thin films that can withstand high temperatures. However, PVD can be costly, and the cost varies depending on the method used. For instance, evaporation is a low-cost PVD method, while ion beam sputtering is rather expensive. Magnetron sputtering, on the other hand, is more expensive but more scalable.

What are the main types of thermal evaporation sources?

The main types of thermal evaporation sources include resistive evaporation sources, electron-beam evaporation sources, and flash evaporation sources. Each type uses different methods to heat the evaporant, such as resistive heating, electron beam heating, or direct contact with a hot surface.

What are the methods used to deposit thin films?

The two main methods used to deposit thin films are chemical vapor deposition (CVD) and physical vapor deposition (PVD). CVD involves introducing reactant gases into a chamber, where they react on the surface of the wafer to form a solid film. PVD does not involve chemical reactions; instead, vapors of constituent materials are created inside the chamber, which then condense on the wafer surface to form a solid film. Common types of PVD include evaporation deposition and sputtering deposition. The three types of evaporation deposition techniques are thermal evaporation, electron-beam evaporation, and inductive heating.

What is magnetron sputtering?

Magnetron sputtering is a plasma-based coating technique used to produce very dense films with excellent adhesion, making it a versatile method for creating coatings on materials that have high melting points and cannot be evaporated. This method generates a magnetically confined plasma near the surface of a target, where positively charged energetic ions collide with the negatively charged target material, causing atoms to be ejected or "sputtered." These ejected atoms are then deposited on a substrate or wafer to create the desired coating.

What is RF PECVD?

RF PECVD stands for radio-frequency plasma-enhanced chemical vapor deposition, which is a technique used to prepare polycrystalline films on a substrate by using glow discharge plasma to influence the process while low pressure chemical vapor deposition is taking place. The RF PECVD method is well established for standard silicon-integrated-circuit technology, where typically flat wafers are used as the substrates. This method is advantageous due to the possibility of low-cost film fabrication and high efficiency of deposition. Materials can also be deposited as graded-refractive-index films or as a stack of nano-films each with different properties.

What is sputtering target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

How do thermal evaporation sources work?

Thermal evaporation sources work by passing electrical current through a resistive material, which heats up to high temperatures. This heat is transferred to the evaporant, causing it to melt and vaporize. The vapor then travels through a vacuum chamber and condenses onto a substrate, forming a thin film.

What is thin film deposition equipment?

Thin film deposition equipment refers to the tools and methods used to create and deposit thin film coatings onto a substrate material. These coatings can be made of various materials and have different characteristics that can improve or alter the substrate's performance. Physical vapor deposition (PVD) is a popular technique that involves vaporizing a solid material in a vacuum, then depositing it onto a substrate. Other methods include evaporation and sputtering. Thin film deposition equipment is used in the production of opto-electronic devices, medical implants, and precision optics, among others.

Why magnetron sputtering?

Magnetron sputtering is preferred due to its ability to achieve high precision in film thickness and density of coatings, surpassing evaporation methods. This technique is especially suitable for creating metallic or insulating coatings with specific optical or electrical properties. Additionally, magnetron sputtering systems can be configured with multiple magnetron sources.

How does RF PECVD work?

RF PECVD works by creating a plasma in a vacuum chamber. The precursor gas is introduced into the chamber, and radio frequency power is applied to create an electric field. This electric field results in the ionization of the precursor gas, forming a plasma. The plasma contains reactive species that can chemically react with the substrate surface, leading to the deposition of a thin film. The RF power also helps to control the energy of the plasma, allowing for better control over film properties such as composition, uniformity, and adhesion. The process parameters, such as gas flow rates, pressure, and RF power, can be adjusted to optimize the film deposition process.

How are sputtering targets made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What are the common materials used for evaporating crucibles?

Evaporating crucibles are commonly made from materials such as tungsten, tantalum, molybdenum, graphite, or ceramic compounds. These materials have high melting points and good thermal conductivity, making them suitable for the high-temperature conditions required during evaporation. The choice of crucible material depends on factors such as the evaporant material, desired film properties, and process parameters.

What are the advantages of using thermal evaporation sources?

The advantages of thermal evaporation sources include high deposition rates, good directionality, excellent uniformity, and compatibility with various materials. They are also relatively simple and affordable, making them suitable for a wide range of applications in thin film deposition.

What is thin-film deposition technology?

Thin film deposition technology is the process of applying a very thin film of material, ranging in thickness from a few nanometers to 100 micrometers, onto a substrate surface or onto previously deposited coatings. This technology is used in the production of modern electronics, including semiconductors, optical devices, solar panels, CDs, and disk drives. The two broad categories of thin film deposition are chemical deposition, where a chemical change produces a chemically deposited coating, and physical vapor deposition, where a material is released from a source and deposited on a substrate using mechanical, electromechanical, or thermodynamic processes.

What are the materials used in thin film deposition?

Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.

The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.

What are the advantages of RF PECVD?

RF PECVD offers several advantages for thin film deposition. Firstly, it allows for the deposition of high-quality films with excellent control over film properties such as thickness, composition, and uniformity. The use of a plasma enhances the reactivity of the process, enabling the deposition of films at lower temperatures compared to traditional thermal CVD methods. RF PECVD also offers better step coverage, allowing for the deposition of films in high aspect ratio structures. Another advantage is the ability to deposit a wide range of materials, including silicon nitride, silicon dioxide, amorphous silicon, and various other thin film materials. The process is highly scalable and can be easily integrated into existing manufacturing processes. Additionally, RF PECVD is a relatively cost-effective method compared to other thin film deposition techniques.

What is sputtering target used for?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What are the advantages of using evaporating crucibles?

Evaporating crucibles offer several advantages in thin film deposition processes. They provide a controlled environment for the evaporation of materials, allowing for precise control over film thickness and uniformity. Crucibles can withstand high temperatures and provide efficient heat transfer, ensuring consistent evaporation rates. They are available in various sizes and shapes to accommodate different evaporation systems and substrate configurations. Evaporating crucibles also allow for the deposition of a wide range of materials, including metals, semiconductors, and ceramics. They can be easily loaded and unloaded, facilitating quick material changes or process adjustments. Overall, evaporating crucibles are essential tools in thin film deposition techniques, offering versatility, reliability, and reproducibility.

What applications are thermal evaporation sources used for?

Thermal evaporation sources are used in various applications such as the production of optical coatings, semiconductor devices, and various types of thin films. They are particularly useful in industries that require precise control over the deposition of materials onto substrates.

What are the advantages of using thin film deposition equipment?

Thin film deposition equipment offers several advantages in various industries and research fields. It enables precise control over film properties such as thickness, composition, and structure, allowing for tailored materials with specific functionalities. Thin films can be deposited over large areas, complex shapes, and different substrate materials. The deposition process can be optimized to achieve high uniformity, adhesion, and purity of the films. Additionally, thin film deposition equipment can operate at relatively low temperatures, reducing thermal stress on the substrate and enabling deposition on temperature-sensitive materials. Thin films find applications in fields such as electronics, optics, energy, coatings, and biomedical devices, offering enhanced performance, protection, or functionality.

What are the methods to achieve optimal thin film deposition?

To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.

The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.

To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.

Uses of Thin Film Deposition

Zinc Oxide-Based Thin Films

ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.

Thin-Film Resistors

Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.

Magnetic Thin Films

Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.

Optical Thin Films

Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.

Polymer Thin Films

Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.

Thin-Film Batteries

Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.

Thin-Film Coatings

Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.

Thin-Film Solar Cells

Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.

What are sputtering targets for electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

How should evaporating crucibles be handled and maintained?

Evaporating crucibles should be handled and maintained with care to ensure their longevity and performance. Crucibles should be cleaned thoroughly before each use to remove any residual material from previous depositions. Avoid using abrasive materials that could damage the crucible's surface. During loading and unloading, handle crucibles with clean gloves or specialized tools to prevent contamination. When not in use, store crucibles in a dry and clean environment to avoid corrosion or degradation. Regular inspection of crucibles for cracks, defects, or signs of wear is important to prevent unexpected failures during the evaporation process. Follow the manufacturer's recommendations for any specific maintenance procedures, such as annealing or surface treatment, to prolong the crucible's lifespan.

What factors should be considered when selecting thin film deposition equipment?

Several factors should be considered when selecting thin film deposition equipment. The technique (PVD, CVD, ALD, MBE) should align with the desired film properties and the specific material being deposited. The size and configuration of the deposition chamber should accommodate the substrate size and shape requirements. The equipment's capabilities in terms of film thickness control, uniformity, and deposition rate should meet the application needs. Considerations should also include the availability and compatibility of precursor materials or target sources for the desired film composition. Other factors to consider are the ease of operation, maintenance requirements, vacuum system reliability, and any additional features such as in situ monitoring or control options. Consulting with experts or manufacturers can provide valuable guidance in selecting the most suitable thin film deposition equipment for a specific application.

Factors and Parameters that Influence Deposition of Thin Films

Deposition Rate:

The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.

Uniformity:

The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.

Fill Capability:

Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.

Film Characteristics:

The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.

Process Temperature:

Film characteristics are significantly affected by process temperature, which may be limited by the application.

Damage:

Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.

What is the lifetime of a sputtering target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.

What safety considerations are associated with operating thin film deposition equipment?

Operating thin film deposition equipment requires certain safety considerations to ensure the well-being of operators and prevent potential hazards. Some deposition techniques involve the use of high temperatures, vacuum environments, or toxic gases. Adequate safety protocols should be in place, including proper training for operators, use of personal protective equipment (PPE), and adherence to safety guidelines provided by the equipment manufacturer and regulatory agencies. Proper ventilation systems should be installed to handle any hazardous gases or by-products generated during the deposition process. Emergency shut-off systems, alarms, and interlocks should be implemented to handle unexpected events or equipment malfunctions. Maintenance and periodic inspections should also be conducted to ensure the equipment's safety and functionality. It is crucial to have well-established safety protocols and follow recommended practices to minimize risks associated with thin film deposition equipment operation.
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PDF - Electron Beam Evaporation Coating Oxygen-Free Copper Crucible

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Catalog of Thin Film Deposition Parts

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Catalog of Evaporation Crucible

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Catalog of Thermal Evaporation Sources

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Catalog of Thin Film Deposition Equipment

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Catalog of Thin Film Deposition Materials

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Catalog of Rf Pecvd

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Catalog of Sputtering Targets

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Thin Film Deposition Processes in Semiconductor Manufacturing

Thin Film Deposition Processes in Semiconductor Manufacturing

An overview of thin film deposition techniques, focusing on Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes in semiconductor manufacturing.

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Understanding Sputtering Deposition Technology

Understanding Sputtering Deposition Technology

An in-depth look at sputtering deposition technology, its mechanisms, types, and applications.

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Coating Methods for Growing Single Crystal Films

Coating Methods for Growing Single Crystal Films

An overview of various coating methods like CVD, PVD, and Epitaxy for growing single crystal films.

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