Products Lab Consumables & Materials Thin Film Deposition Parts Electron Beam Evaporation Coating Conductive Boron Nitride Crucible (BN Crucible)
Electron Beam Evaporation Coating Conductive Boron Nitride Crucible (BN Crucible)

Thin Film Deposition Parts

Electron Beam Evaporation Coating Conductive Boron Nitride Crucible (BN Crucible)

Item Number : KES03

Price varies based on specs and customizations


Material
Boron nitride
Specification
35-64.5mm*17-35mm
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Application

Conductive boron nitride crucibles are high-purity, smooth crucibles designed for electron beam evaporation coatings. It has excellent high temperature resistance and thermal cycle performance, and does not react with various metals and ceramic rare earths. The crucible remains intact even under rapid heating and cooling conditions. It has applications in alloy melting, rare earth and ceramic sintering, and electron beam evaporation coating. It is often used in thermal evaporation processes such as high-frequency induction heating, coating, electron beam evaporation coating, aluminum plating, and silicon plating.

The conductive boron nitride crucible has high purity, high finish, and excellent electron beam evaporation coating performance. They can increase evaporation rates, accelerate material switching, improve thermal stability and reduce power requirements, ultimately increasing productivity and cost efficiency.

Detail & Parts

Electron beam evaporation coating conductive boron nitride crucible  detail

Electron beam evaporation coating conductive boron nitride crucible  detail 2

Electron beam evaporation coating conductive boron nitride crucible details3

Technical Specifications

Outer diameter 35mm 40mm 45mm 50mm 64.5mm
High 17mm 20mm 22.5mm 25mm 35mm

The crucibles we show are available in different sizes and custom sizes are available on request.

Advantage

  • The film has good finish, high purity, less pollution and long service life.
  • Excellent high temperature resistance, heat cycle resistance.
  • Low thermal expansion, resists wetting by most molten metals.
  • Heat resistance up to 2000℃, boron nitride does not react with aluminum and is not easy to volatilize.
  • Increased evaporation rate; Increased evaporation rate reduces cycle time and increases overall yield.
  • Fast material changeover; Conductive boron nitride crucibles facilitate fast material changeover, minimizing chamber downtime and increasing process efficiency.
  • Enhanced Thermal Stability; These crucibles have increased thermal stability, reducing heat transfer from the crucible itself and ensuring consistent and controlled evaporation.

FAQ

What Are The Applications Of Boron Nitride Ceramic Parts?

Boron Nitride ceramic parts find applications in various industries. They are commonly used in high-temperature environments, such as in thermal management systems, crucibles, heaters, and insulators. Due to their excellent thermal conductivity, Boron Nitride ceramic parts are used as heat sinks, substrates for electronic devices, and components in high-power electronics. They are also utilized in the aerospace industry for applications requiring lightweight and high-temperature resistance, such as rocket nozzles and thermal shields. Boron Nitride ceramic parts are also used in the semiconductor industry as wafer carriers, crucibles for crystal growth, and insulators. Additionally, they find applications in the chemical industry, where their chemical inertness and resistance to corrosion make them suitable for handling corrosive materials.

What Are Thermal Evaporation Sources?

Thermal evaporation sources are devices used in thermal evaporation systems to deposit thin films onto substrates. They work by heating a material (evaporant) to high temperatures, causing it to evaporate and then condense onto a substrate, forming a thin film.

What Is Physical Vapor Deposition (PVD)?

Physical vapor deposition (PVD) is a technique for depositing thin films by vaporizing a solid material in a vacuum and then depositing it onto a substrate. PVD coatings are highly durable, scratch-resistant, and corrosion-resistant, making them ideal for a variety of applications, from solar cells to semiconductors. PVD also creates thin films that can withstand high temperatures. However, PVD can be costly, and the cost varies depending on the method used. For instance, evaporation is a low-cost PVD method, while ion beam sputtering is rather expensive. Magnetron sputtering, on the other hand, is more expensive but more scalable.

What Are The Advantages Of Using Boron Nitride Ceramic Parts?

Using Boron Nitride ceramic parts offers several advantages. Firstly, their high thermal conductivity allows for efficient heat transfer, making them ideal for applications requiring heat dissipation or thermal management. Secondly, Boron Nitride ceramics exhibit excellent electrical insulation properties, making them suitable for electrical and electronic applications. They have low dielectric loss and high dielectric strength, allowing for reliable electrical insulation even at high temperatures. Additionally, Boron Nitride ceramic parts have a low coefficient of friction, providing excellent lubrication and wear resistance in applications where low friction is desired. They are also chemically inert, making them resistant to most acids, alkalis, and molten metals. Boron Nitride ceramic parts can withstand high temperatures without significant deformation or degradation, making them suitable for use in extreme environments.

What Are The Main Types Of Thermal Evaporation Sources?

The main types of thermal evaporation sources include resistive evaporation sources, electron-beam evaporation sources, and flash evaporation sources. Each type uses different methods to heat the evaporant, such as resistive heating, electron beam heating, or direct contact with a hot surface.

What Is Magnetron Sputtering?

Magnetron sputtering is a plasma-based coating technique used to produce very dense films with excellent adhesion, making it a versatile method for creating coatings on materials that have high melting points and cannot be evaporated. This method generates a magnetically confined plasma near the surface of a target, where positively charged energetic ions collide with the negatively charged target material, causing atoms to be ejected or "sputtered." These ejected atoms are then deposited on a substrate or wafer to create the desired coating.

What Is Sputtering Target?

A sputtering target is a material used in the process of sputter deposition, which involves breaking up the target material into tiny particles that form a spray and coat a substrate, such as a silicon wafer. Sputtering targets are typically metallic elements or alloys, although some ceramic targets are available. They come in a variety of sizes and shapes, with some manufacturers creating segmented targets for larger sputtering equipment. Sputtering targets have a wide range of applications in fields such as microelectronics, thin film solar cells, optoelectronics, and decorative coatings due to their ability to deposit thin films with high precision and uniformity.

What Considerations Should Be Made When Selecting Boron Nitride Ceramic Parts?

Several considerations should be made when selecting Boron Nitride ceramic parts. Firstly, the specific application requirements should be evaluated, such as temperature range, electrical insulation properties, thermal conductivity, mechanical strength, and chemical resistance. This will help determine the appropriate grade or formulation of Boron Nitride ceramic to select. Secondly, the design and geometry of the ceramic part should be considered to ensure that it can be manufactured using the available processes and equipment. The dimensional tolerances and surface finish requirements should also be taken into account. Additionally, the cost and availability of the Boron Nitride ceramic parts should be considered, as different manufacturing processes and grades of Boron Nitride can vary in cost. It is advisable to consult with manufacturers or experts in the field to ensure that the selected Boron Nitride ceramic parts meet the specific application requirements.

How Do Thermal Evaporation Sources Work?

Thermal evaporation sources work by passing electrical current through a resistive material, which heats up to high temperatures. This heat is transferred to the evaporant, causing it to melt and vaporize. The vapor then travels through a vacuum chamber and condenses onto a substrate, forming a thin film.

Why Magnetron Sputtering?

Magnetron sputtering is preferred due to its ability to achieve high precision in film thickness and density of coatings, surpassing evaporation methods. This technique is especially suitable for creating metallic or insulating coatings with specific optical or electrical properties. Additionally, magnetron sputtering systems can be configured with multiple magnetron sources.

How Are Sputtering Targets Made?

Sputtering targets are made using a variety of manufacturing processes depending on the properties of the target material and its application. These include vacuum melting and rolling, hot-pressed, special press-sintered process, vacuum hot-pressed, and forged methods. Most sputtering target materials can be fabricated into a wide range of shapes and sizes, with circular or rectangular shapes being the most common. Targets are usually made from metallic elements or alloys, but ceramic targets can also be used. Compound sputtering targets are also available, made from a variety of compounds including oxides, nitrides, borides, sulphides, selenides, tellurides, carbides, crystalline, and composite mixtures.

What Manufacturing Processes Are Used To Produce Boron Nitride Ceramic Parts?

Several manufacturing processes can be used to produce Boron Nitride ceramic parts. The most common methods include hot pressing, hot isostatic pressing (HIP), and slip casting. Hot pressing involves compacting Boron Nitride powders under high pressure and temperature to form a dense ceramic. HIP involves subjecting the Boron Nitride powder compact to high temperature and pressure in an inert gas environment to achieve even higher density and eliminate any remaining porosity. Slip casting involves forming a slurry of Boron Nitride powder and a binder, pouring it into a mold, and then drying and firing the green body to produce the final ceramic part. Other processes, such as extrusion, injection molding, or machining, may be used for shaping and finishing the Boron Nitride ceramic parts, depending on the desired geometry and specifications.

What Are The Advantages Of Using Thermal Evaporation Sources?

The advantages of thermal evaporation sources include high deposition rates, good directionality, excellent uniformity, and compatibility with various materials. They are also relatively simple and affordable, making them suitable for a wide range of applications in thin film deposition.

What Are The Materials Used In Thin Film Deposition?

Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.

The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.

What Is Sputtering Target Used For?

Sputtering targets are used in a process called sputtering to deposit thin films of a material onto a substrate using ions to bombard the target. These targets have a wide range of applications in various fields, including microelectronics, thin film solar cells, optoelectronics, and decorative coatings. They allow for the deposition of thin films of materials onto a variety of substrates with high precision and uniformity, making them an ideal tool for producing precision products. Sputtering targets come in various shapes and sizes and can be specialized to meet the specific requirements of the application.

What Applications Are Thermal Evaporation Sources Used For?

Thermal evaporation sources are used in various applications such as the production of optical coatings, semiconductor devices, and various types of thin films. They are particularly useful in industries that require precise control over the deposition of materials onto substrates.

What Are The Methods To Achieve Optimal Thin Film Deposition?

To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.

The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.

To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.

Uses Of Thin Film Deposition

Zinc Oxide-Based Thin Films

ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.

Thin-Film Resistors

Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.

Magnetic Thin Films

Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.

Optical Thin Films

Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.

Polymer Thin Films

Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.

Thin-Film Batteries

Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.

Thin-Film Coatings

Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.

Thin-Film Solar Cells

Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.

What Are Sputtering Targets For Electronics?

Sputtering targets for electronics are thin discs or sheets of materials such as aluminum, copper, and titanium that are used to deposit thin films onto silicon wafers to create electronic devices like transistors, diodes, and integrated circuits. These targets are used in a process called sputtering, in which atoms of the target material are physically ejected from the surface and deposited onto a substrate by bombarding the target with ions. Sputtering targets for electronics are essential in the production of microelectronics and typically require high precision and uniformity to ensure quality devices.

Factors And Parameters That Influence Deposition Of Thin Films

Deposition Rate:

The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.

Uniformity:

The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.

Fill Capability:

Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.

Film Characteristics:

The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.

Process Temperature:

Film characteristics are significantly affected by process temperature, which may be limited by the application.

Damage:

Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.

What Is The Lifetime Of A Sputtering Target?

The lifetime of a sputtering target depends on factors such as the material composition, purity, and the specific application it is being used for. Generally, targets can last for several hundred to a few thousand hours of sputtering, but this can vary widely depending on the specific conditions of each run. Proper handling and maintenance can also extend the lifetime of a target. In addition, the use of rotary sputtering targets can increase runtimes and reduce the occurrence of defects, making them a more cost-effective option for high volume processes.
View more faqs for this product

4.9

out of

5

The boron nitride crucible delivered in 3 days, which is really fast! The quality is excellent and it fits perfectly in my electron beam evaporator.

Yuxin Cheng

4.7

out of

5

I'm very impressed with the performance of this crucible. It has increased the evaporation rate and reduced the power requirements in my electron beam evaporator.

Hannes Marquardt

4.8

out of

5

The conductive boron nitride crucible is a great choice for electron beam evaporation coating. It has a long service life and produces high-quality films.

Alexei Orlov

4.6

out of

5

I've been using this crucible for several months now and I'm very happy with it. It's very durable and has helped me to improve the quality of my coatings.

Juanita Garcia

4.9

out of

5

This crucible is a game-changer! It has significantly improved the efficiency of my electron beam evaporator and reduced my production costs.

Omar Sy

4.7

out of

5

I highly recommend this crucible to anyone who is looking for a high-quality and durable option for electron beam evaporation coating.

Adeline Dubois

4.8

out of

5

The conductive boron nitride crucible is an excellent choice for high-temperature applications. It has excellent thermal stability and resists wetting by most molten metals.

Mohammad Reza

4.6

out of

5

I'm very satisfied with this crucible. It has helped me to improve the quality of my coatings and reduce my production costs.

Maria Rodriguez

4.9

out of

5

This crucible is a must-have for anyone who is serious about electron beam evaporation coating. It's a great value for the price.

Aiden Smith

4.7

out of

5

I'm very impressed with the performance of this crucible. It has exceeded my expectations and I highly recommend it.

Isabelle Dubois

4.8

out of

5

The conductive boron nitride crucible is a great choice for electron beam evaporation coating. It's easy to use and produces high-quality films.

Alireza Mohammad

4.6

out of

5

I've been using this crucible for a few weeks now and I'm very happy with it. It's very durable and has helped me to improve the quality of my coatings.

Sofia Martinez

4.9

out of

5

This crucible is a game-changer! It has significantly improved the efficiency of my electron beam evaporator and reduced my production costs.

Oliver Chen

4.7

out of

5

I highly recommend this crucible to anyone who is looking for a high-quality and durable option for electron beam evaporation coating.

Chloe Dubois

4.8

out of

5

The conductive boron nitride crucible is an excellent choice for high-temperature applications. It has excellent thermal stability and resists wetting by most molten metals.

Hassan Ali

4.6

out of

5

I'm very satisfied with this crucible. It has helped me to improve the quality of my coatings and reduce my production costs.

Isabella Garcia

PDF - Electron Beam Evaporation Coating Conductive Boron Nitride Crucible (BN Crucible)

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Catalog of Thin Film Deposition Parts

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Catalog of Boron Nitride Ceramics

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Catalog of Thermal Evaporation Sources

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Catalog of Thin Film Deposition Materials

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Catalog of Sputtering Targets

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