The target is indeed the cathode in sputtering.
Explanation:
In the process of sputtering, a solid target is used as the cathode. This target is subjected to bombardment by high-energy ions, typically generated by a discharge in a DC field. The target is negatively charged, typically at a potential of several hundred volts, which contrasts with the substrate, which is positively charged. This electrical setup is crucial for the sputtering process to occur effectively.
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Electrical Configuration: The target, acting as the cathode, is negatively charged, attracting positively charged ions from the plasma. This plasma is usually created by introducing an inert gas, commonly argon, into the system. The ionization of argon gas results in the formation of Ar+ ions, which are accelerated towards the negatively charged target due to the electrical potential difference.
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Sputtering Mechanism: When the Ar+ ions collide with the target (cathode), they dislodge atoms from the surface of the target through a process called sputtering. These dislodged atoms then deposit onto a substrate, forming a thin film. This process is efficient as long as the target is metallic and can maintain its negative charge. Non-conductive targets can become positively charged, which inhibits the sputtering process by repelling the incoming ions.
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Technological Advancements: Over time, the design and setup of sputtering systems have evolved to improve efficiency and control over the deposition process. Early systems were relatively simple, consisting of a cathodic target and an anodic substrate holder. However, these setups had limitations such as low deposition rates and high voltage requirements. Modern advancements, such as magnetron sputtering, have addressed some of these issues but also introduced new challenges, like the potential poisoning of the cathode in reactive sputtering modes.
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Material Considerations: The choice of target material is also critical. Commonly, materials like gold or chromium are used as they offer specific benefits such as finer grain size and thinner continuous coatings. The vacuum conditions required for effective sputtering with certain materials can be more stringent, necessitating advanced vacuum systems.
In summary, the target in sputtering is the cathode, and its role is pivotal in the deposition of materials onto substrates through the controlled bombardment of high-energy ions. The process is influenced by the electrical configuration, the nature of the target material, and the technological setup of the sputtering system.
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