Sputtering is a process that relies on the transfer of momentum from energetic ions to atoms in a solid target material.
This transfer results in the ejection of these atoms into the gas phase.
The process is essential for the deposition of thin films and various analytical techniques.
What Transfer is Sputtering Based On? 5 Key Points Explained
1. Ion Bombardment
In the sputtering process, ions of an inert gas, typically argon, are accelerated by an electric field towards a target material.
These ions are positively charged and are attracted to the negatively charged target at high velocities.
2. Momentum Transfer
Upon impact, the energetic ions transfer their momentum to the atoms of the target material.
This transfer is partly inelastic, meaning that some of the kinetic energy of the ions is converted into vibrational energy within the target material.
3. Ejection of Target Atoms
The transferred momentum is sufficient to overcome the bonding energy between the target atoms.
This causes them to be ejected from the material lattice into the gaseous state within the coating chamber.
This ejection of atoms is known as sputtering.
4. Deposition onto Substrates
The sputtered atoms or particles travel across the vacuum space and are deposited onto a substrate, forming a thin film.
This deposition can occur by line of sight or the particles can be ionized again and accelerated by electrical forces to the substrate.
5. Versatility in Application
Since sputtering does not require the melting of the source material, it can be applied to various orientations and complex shapes.
This makes it a versatile method for coating different types of surfaces.
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