Plasma is created in the sputtering process primarily through gas ionization.
This method involves several key steps and conditions.
Here's a detailed breakdown:
1. Gas Introduction and Pressure Control
The process begins by introducing a noble gas, typically argon, into a vacuum chamber.
The pressure inside the chamber is carefully controlled, usually reaching a maximum of 0.1 Torr.
This low-pressure environment is crucial for the subsequent ionization process.
2. Application of High Voltage
Once the desired pressure is achieved, a high voltage is applied to the gas.
This voltage can be either DC (direct current) or RF (radio frequency).
It is necessary to ionize the argon atoms.
The ionization potential of argon is about 15.8 electron volts (eV).
The voltage applied must overcome this to initiate ionization.
3. Formation of Plasma
The applied voltage causes the argon atoms to lose electrons, transforming them into positively charged ions.
This process of ionization creates a plasma.
A plasma is a state of matter where electrons are dissociated from their nuclei.
The plasma thus formed contains a mixture of argon ions, electrons, and some neutral atoms.
4. Interaction with the Target Material
The plasma is generated in close proximity to a target material, typically a metal or ceramic, which is to be sputtered.
The target is positioned near a magnet assembly.
When the plasma is active, the argon ions are accelerated towards the target due to the electric field.
These high-energy ions collide with the target surface, dislodging atoms from the target.
Sputtering and Coating
The dislodged atoms from the target are ejected into the gas phase and can then deposit onto a nearby substrate, forming a thin film.
This process is known as sputtering.
The rate of sputtering depends on several factors including the sputter yield, molar weight of the target, material density, and ion current density.
Enhancement Techniques
To improve the sputtering process, techniques such as three-pole sputtering can be employed.
This method uses a hot wire arc discharge to enhance the glow discharge.
However, these methods can be challenging to implement for uniform coating over large areas and are not commonly used in industry.
In summary, plasma in sputtering is created by ionizing a noble gas like argon under controlled low pressure conditions using a high voltage.
This plasma then interacts with a target material to eject atoms that can be deposited as a thin film on a substrate.
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