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Inclined Rotary Plasma Enhanced Chemical Vapor Deposition PECVD Equipment Tube Furnace Machine

CVD & PECVD Furnace

Inclined Rotary Plasma Enhanced Chemical Vapor Deposition PECVD Equipment Tube Furnace Machine

Item Number : KT-PE16

Price varies based on specs and customizations

Max. temperature
1600 ℃
Constant work temperature
1550 ℃
Furnace tube diameter
60 mm
Heating zone length
2x300 mm
Heating rate
0-10 ℃/min
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Play Video: Inclined Rotary Plasma Enhanced Chemical Vapor Deposition PECVD Equipment Tube Furnace Machine

Introduction

The Inclined Rotary Plasma Enhanced Chemical Deposition (PECVD) Tube Furnace Machine is a plasma-enhanced rotary chemical vapor deposition system that uses a rotating furnace tube and plasma generator to induce chemical reactions in a gaseous discharge. This process produces a wide variety of chemical species that can be used to form solid deposits on materials. The machine is equipped with a three-way mass flow meter and a gas mixing device, which allows for precise control of the gases used in the process. The rotating furnace tube ensures uniform heating and mixing of materials, while the plasma generator provides the activation energy needed for chemical reactions. The machine is also equipped with a high-performance mechanical pump that can quickly evacuate the furnace tube to vacuum.

PECVD front

PECVD side

PECVD side

PECVD local

PECVD local

Applications

PECVD tube furnace machines are used in a variety of applications, including:

  • Semiconductor manufacturing:** PECVD is used to deposit thin films of materials such as silicon nitride, silicon dioxide, and polysilicon on semiconductor wafers.
  • Solar cell manufacturing:** PECVD is used to deposit thin films of materials such as cadmium telluride and copper indium gallium selenide on solar cells.
  • Flat panel display manufacturing:** PECVD is used to deposit thin films of materials such as indium tin oxide and zinc oxide on flat panel displays.
  • Optical coating:** PECVD is used to deposit thin films of materials such as titanium dioxide and silicon nitride on optical components.
  • Medical device manufacturing:** PECVD is used to deposit thin films of materials such as hydroxyapatite and titanium nitride on medical devices.

Principle

Inclined Rotary Plasma Enhanced Chemical Deposition (PECVD) Tube Furnace Machine is a plasma-enhanced rotary chemical vapor deposition system. The furnace tube adopts a variable-diameter design with a mixing baffle, allowing for uniform heating and efficient mixing of materials. The plasma generator connected via inductive coupling covers the furnace tube, providing increased activation energy, lowering reaction temperature, and improving efficiency. The equipment utilizes a three-way mass flow meter and gas mixing device for precise gas control. Additionally, a high-performance mechanical pump enables rapid evacuation of the furnace tube, creating a vacuum environment suitable for various CVD processes.

Features

The Inclined Rotary Plasma Enhanced Chemical Deposition (PECVD) Tube Furnace Machine boasts an array of cutting-edge features that empower researchers and engineers to achieve unparalleled results in their materials processing endeavors:

  • Precise Temperature Control: PID programmable temperature control ensures exceptional accuracy and stability, enabling precise heating and cooling cycles for optimal material properties.
  • Versatile Plasma Source: The RF plasma source with an extensive power range of 5-500W provides flexibility and control over plasma generation, promoting efficient and tailored material deposition.
  • Uniform Mixing and Heating: The rotating furnace tube, featuring a variable-diameter design and mixing baffle, ensures thorough mixing of materials and uniform heating, resulting in consistent and high-quality deposition results.
  • Automated Sliding System: The furnace chamber's sliding system facilitates rapid heating and cooling, minimizing processing time and enhancing productivity.
  • Precise Gas Control: High-precision MFC mass flowmeters and a gas mixing device enable precise control of gas composition and flow rates, optimizing deposition processes for specific materials and applications.
  • Robust Construction: The stainless steel vacuum flange with adaptable ports ensures reliable sealing and high vacuum levels, maintaining a pristine deposition environment.
  • Intuitive Interface: The CTF Pro controller with a 7-inch TFT touch screen provides user-friendly program setting, data analysis, and remote control capabilities, streamlining operation and data management.

Advantages

  • RF plasma automatic matching source, wide 5-500W output power range stable output
  • Furnace chamber sliding system for high speed heating and short time cooling, auxiliary fast cooling and automatic sliding movement are available
  • PID programmable temperature control, excellent control accuracy and support remote control and centralized control
  • High accuracy MFC mass flowmeter control, source gases premixing and stable gas supply speed
  • Stainless steel vacuum flange with various adapting port to meet different vacuum pump station setup, good sealing and high vacuum degree
  • CTF Pro applies one 7 inches TFT touch screen controller, more friendly program setting and history data analysis
  • Low maintenance;Easy to install;Rigid design;Top performance;Longer working life.

Safety Advantage

  • Kindle Tech tube furnace owns over current protection and over temperature alarming function, furnace will turn off the power automatically
  • Furnace build in thermal couple detecting function, furnace will stop heating and alarm will be on once broken or failure detected
  • PE Pro support power failure restarting function,furnace will resume the furnace heating program when power is incoming after failure

Technical specifications

Furnace model PE-1600-60
Max. temperature 1600℃
Constant work temperature 1550℃
Furnace tube material High purity Al2O3 tube
Furnace tube diameter 60mm
Heating zone length 2x300mm
Chamber material Japan alumina fiber
Heating element Molybdenum Disilicide
Heating rate 0-10℃/min
Thermal couple B type
Temperature controller Digital PID controller/Touch screen PID controller
Temperature control accuracy ±1℃
RF Plasma unit
Output Power  5 -500W adjustable with ± 1% stability
RF frequency 13.56 MHz ±0.005% stability
Reflection Power 350W max.
Matching Automatic
Noise <50 dB
Cooling Air cooling.
Gas precise control unit
Flow meter MFC mass flow meter
Gas channels 4 channels
Flow rate MFC1: 0-5SCCM O2
MFC2: 0-20SCMCH4
MFC3: 0- 100SCCM H2
MFC4: 0-500 SCCM N2
Linearity ±0.5% F.S.
Repeatability ±0.2% F.S.
 Pipe line and valve Stainless steel
Maximum Operating Pressure 0.45MPa
Flow meter controller Digital Knob controller/Touch screen controller
Standard vacuum unit(Optional)
Vacuum pump Rotary vane vacuum pump
Pump flow rate 4L/S
Vacuum suction port KF25
Vacuum gauge Pirani/Resistance silicon vacuum gauge
Rated vacuum pressure 10Pa
High vacuum unit(Optional)
Vacuum pump Rotary vane pump+Molecular pump
Pump flow rate 4L/S+110L/S
Vacuum suction port KF25
Vacuum gauge Compound vacuum gauge
Rated vacuum pressure 6x10-5Pa
Above specifications and setups can be customized

Standard Package

No. Description Quantity
1 Furnace 1
2 Quartz tube 1
3 Vacuum flange 2
4 Tube thermal block 2
5 Tube thermal block hook 1
6 Heat resistant glove 1
7 RF plasma source 1
8 Precise gas control 1
9 Vacuum unit 1
10 Operation manual 1

Optional Setup

  • In tube gases detecting and monitoring,like H2, O2 and so on
  • Independent furnace temperature monitoring and recording
  • RS 485 communication port for PC remote control and data exporting
  • Insert gases feeding flow rate control,like mass flowmeter and float flowmeter
  • Touch screen temperature controller with versatile operator friendly functions
  • High vacuum pump station setups, like vane vacuum pump,molecular pump,diffusion pump

Warnings

Operator safety is the top important issue! Please operate the equipment with cautions. Working with inflammable& explosive or toxic gases is very dangerous, operators must take all necessary precautions before starting the equipment. Working with positive pressure inside the reactors or chambers is dangerous, operator must fellow the safety procedures strictly. Extra caution must also be taken when operating with air-reactive materials, especially under vacuum. A leak can draw air into the apparatus and cause a violent reaction to occur.

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FAQ

What Is Physical Vapor Deposition (PVD)?

Physical vapor deposition (PVD) is a technique for depositing thin films by vaporizing a solid material in a vacuum and then depositing it onto a substrate. PVD coatings are highly durable, scratch-resistant, and corrosion-resistant, making them ideal for a variety of applications, from solar cells to semiconductors. PVD also creates thin films that can withstand high temperatures. However, PVD can be costly, and the cost varies depending on the method used. For instance, evaporation is a low-cost PVD method, while ion beam sputtering is rather expensive. Magnetron sputtering, on the other hand, is more expensive but more scalable.

What Is PECVD Method?

PECVD (Plasma Enhanced Chemical Vapor Deposition) is a process used in semiconductor manufacturing to deposit thin films on microelectronic devices, photovoltaic cells, and display panels. In PECVD, a precursor is introduced to the reaction chamber in a gaseous state, and the assistance of plasma reactive media dissociates the precursor at much lower temperatures than with CVD. PECVD systems offer excellent film uniformity, low-temperature processing, and high throughput. They are used in a wide range of applications and will play an increasingly important role in the semiconductor industry as the demand for advanced electronic devices continues to grow.

What Are The Methods Used To Deposit Thin Films?

The two main methods used to deposit thin films are chemical vapor deposition (CVD) and physical vapor deposition (PVD). CVD involves introducing reactant gases into a chamber, where they react on the surface of the wafer to form a solid film. PVD does not involve chemical reactions; instead, vapors of constituent materials are created inside the chamber, which then condense on the wafer surface to form a solid film. Common types of PVD include evaporation deposition and sputtering deposition. The three types of evaporation deposition techniques are thermal evaporation, electron-beam evaporation, and inductive heating.

What Is Mpcvd?

MPCVD stands for Microwave Plasma Chemical Vapor Deposition and it is a process of depositing thin films onto a surface. It uses a vacuum chamber, microwave generator, and gas delivery system to create a plasma made up of reacting chemicals and necessary catalysts. MPCVD is heavily used in the ANFF network to deposit layers of diamond using methane and hydrogen to grow new diamond on a diamond-seeded substrate. It is a promising technology for producing low-cost, high-quality large diamonds and is extensively used in the semiconductor and diamond cutting industry.

What Is Magnetron Sputtering?

Magnetron sputtering is a plasma-based coating technique used to produce very dense films with excellent adhesion, making it a versatile method for creating coatings on materials that have high melting points and cannot be evaporated. This method generates a magnetically confined plasma near the surface of a target, where positively charged energetic ions collide with the negatively charged target material, causing atoms to be ejected or "sputtered." These ejected atoms are then deposited on a substrate or wafer to create the desired coating.

What Is The Basic Principle Of CVD?

The basic principle of Chemical Vapor Deposition (CVD) is to expose a substrate to one or more volatile precursors that react or decompose on its surface to produce a thin film deposit. This process can be used for various applications, such as patterning films, insulation materials, and conducting metal layers. CVD is a versatile process that can synthesize coatings, powders, fibers, nanotubes, and monolithic components. It is also capable of producing most of the metal and metal alloys and their compounds, semiconductors, and nonmetal systems. The deposition of a solid on a heated surface from a chemical reaction in the vapor phase characterizes the CVD process.

What Is PECVD Used For?

PECVD (Plasma Enhanced Chemical Vapor Deposition) is widely used in the semiconductor industry to fabricate integrated circuits, as well as in the photovoltaic, tribological, optical, and biomedical fields. It is used to deposit thin films for microelectronic devices, photovoltaic cells, and display panels. PECVD can produce unique compounds and films that cannot be created by common CVD techniques alone, and films that demonstrate high solvent and corrosion resistance with chemical and thermal stability. It is also used to produce homogenous organic and inorganic polymers over large surfaces, and Diamond-like Carbon (DLC) for tribological applications.

What Is Thin Film Deposition Equipment?

Thin film deposition equipment refers to the tools and methods used to create and deposit thin film coatings onto a substrate material. These coatings can be made of various materials and have different characteristics that can improve or alter the substrate's performance. Physical vapor deposition (PVD) is a popular technique that involves vaporizing a solid material in a vacuum, then depositing it onto a substrate. Other methods include evaporation and sputtering. Thin film deposition equipment is used in the production of opto-electronic devices, medical implants, and precision optics, among others.

What Is Mpcvd Machine?

The MPCVD (Microwave Plasma Chemical Vapor Deposition) machine is a laboratory equipment used to grow high-quality diamond films. It uses a carbon-containing gas and a microwave plasma to create a plasma ball above the diamond substrate, which heats it to a specific temperature. The plasma ball doesn't contact the cavity wall, making the diamond growth process free from impurities and enhancing the diamond's quality. The MPCVD system consists of a vacuum chamber, a microwave generator, and a gas delivery system that controls the flow of gas into the chamber.

Why Magnetron Sputtering?

Magnetron sputtering is preferred due to its ability to achieve high precision in film thickness and density of coatings, surpassing evaporation methods. This technique is especially suitable for creating metallic or insulating coatings with specific optical or electrical properties. Additionally, magnetron sputtering systems can be configured with multiple magnetron sources.

What Are The Different Types Of CVD Method?

The different types of CVD methods include atmospheric pressure CVD (APCVD), low-pressure CVD (LPCVD), ultrahigh vacuum CVD, CVD supported by aerosols, direct liquid injection CVD, hot wall CVD, cold wall CVD, microwave plasma CVD, plasma-enhanced CVD (PECVD), remote plasma-enhanced CVD, low-energy plasma-enhanced CVD, atomic layer CVD, combustion CVD, and hot filament CVD. These methods differ in the mechanism by which chemical reactions are triggered and the operating conditions.

What Are The Advantages Of PECVD?

The primary advantages of PECVD are its ability to operate at lower deposition temperatures, providing better conformity and step coverage on uneven surfaces, tighter control of the thin film process, and high deposition rates. PECVD allows for successful applications in situations where conventional CVD temperatures could potentially damage the device or substrate being coated. By operating at a lower temperature, PECVD creates less stress between thin film layers, allowing for high-efficiency electrical performance and bonding to very high standards.

What Is Thin-film Deposition Technology?

Thin film deposition technology is the process of applying a very thin film of material, ranging in thickness from a few nanometers to 100 micrometers, onto a substrate surface or onto previously deposited coatings. This technology is used in the production of modern electronics, including semiconductors, optical devices, solar panels, CDs, and disk drives. The two broad categories of thin film deposition are chemical deposition, where a chemical change produces a chemically deposited coating, and physical vapor deposition, where a material is released from a source and deposited on a substrate using mechanical, electromechanical, or thermodynamic processes.

What Are The Advantages Of Mpcvd?

MPCVD has several advantages over other methods of diamond production, such as higher purity, less energy consumption, and the ability to produce larger diamonds.

What Are The Materials Used In Thin Film Deposition?

Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.

The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.

What Are The Advantages Of Using Chemical Vapor Deposition Machines?

Chemical vapor deposition machines offer several advantages in thin film deposition. They allow for precise control over the film's properties, such as thickness, composition, and uniformity. CVD can deposit films over large areas and complex shapes, making it suitable for a wide range of applications. The technique enables the deposition of a variety of materials, including metals, semiconductors, ceramics, and organic compounds. CVD films can exhibit excellent adhesion, purity, and conformality to the substrate surface. Additionally, CVD machines can operate at relatively low temperatures, reducing thermal stress on the substrate and enabling deposition on temperature-sensitive materials.

What Is The Difference Between ALD And PECVD?

ALD is a thin film deposition process that allows for atomic layer thickness resolution, excellent uniformity of high aspect ratio surfaces and pinhole-free layers. This is achieved by the continuous formation of atomic layers in a self-limiting reaction. PECVD, on the other hand, involves mixing the source material with one or more volatile precursors using a plasma to chemically interact and breakdown the source material. The processes use heat with higher pressures leading to a more reproducible film where the film thicknesses could be managed by time/power. These films are more stoichiometric, denser and are capable of growing higher quality insulator films.

What Are The Advantages Of Using Thin Film Deposition Equipment?

Thin film deposition equipment offers several advantages in various industries and research fields. It enables precise control over film properties such as thickness, composition, and structure, allowing for tailored materials with specific functionalities. Thin films can be deposited over large areas, complex shapes, and different substrate materials. The deposition process can be optimized to achieve high uniformity, adhesion, and purity of the films. Additionally, thin film deposition equipment can operate at relatively low temperatures, reducing thermal stress on the substrate and enabling deposition on temperature-sensitive materials. Thin films find applications in fields such as electronics, optics, energy, coatings, and biomedical devices, offering enhanced performance, protection, or functionality.

Are CVD Diamonds Real Or Fake?

CVD diamonds are real diamonds and not fake. They are grown in a laboratory through a process called Chemical Vapor Deposition (CVD). Unlike natural diamonds that are mined from under the earth's surface, CVD diamonds are created using advanced technology in labs. These diamonds are 100% carbon and are the purest form of diamonds known as Type IIa diamonds. They have the same optical, thermal, physical, and chemical properties as natural diamonds. The only difference is that CVD diamonds are created in a lab and not mined from the earth.

What Are The Methods To Achieve Optimal Thin Film Deposition?

To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.

The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.

To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.

Uses Of Thin Film Deposition

Zinc Oxide-Based Thin Films

ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.

Thin-Film Resistors

Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.

Magnetic Thin Films

Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.

Optical Thin Films

Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.

Polymer Thin Films

Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.

Thin-Film Batteries

Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.

Thin-Film Coatings

Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.

Thin-Film Solar Cells

Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.

What Are The Applications Of Chemical Vapor Deposition Machines?

Chemical vapor deposition machines find applications in various industries and research fields. In the semiconductor industry, CVD is used to deposit thin films for integrated circuits, such as silicon dioxide and silicon nitride. CVD is also employed in the production of thin film solar cells, where materials like cadmium telluride or copper indium gallium selenide are deposited. Other applications include the deposition of protective coatings, such as diamond-like carbon films, wear-resistant coatings, and anti-reflective coatings. CVD is also utilized in the production of optical coatings, such as thin films for mirrors, filters, and waveguides.

What Is The Difference Between PECVD And Sputtering?

PECVD and sputtering are both physical vapor deposition techniques used for thin film deposition. PECVD is a diffusive gas-driven process that yields very high-quality thin films while sputtering is a line-of-sight deposition. PECVD allows for better coverage on uneven surfaces such as trenches, walls, and high conformity and can produce unique compounds and films. On the other hand, sputtering is good for the deposition of fine layers of several materials, ideal for creating multi-layered and multi-graduated coating systems. PECVD is mainly used in the semiconductor industry, tribological, optical, and biomedical fields while sputtering is mostly used for dielectric materials and tribological applications.

What Factors Should Be Considered When Selecting Thin Film Deposition Equipment?

Several factors should be considered when selecting thin film deposition equipment. The technique (PVD, CVD, ALD, MBE) should align with the desired film properties and the specific material being deposited. The size and configuration of the deposition chamber should accommodate the substrate size and shape requirements. The equipment's capabilities in terms of film thickness control, uniformity, and deposition rate should meet the application needs. Considerations should also include the availability and compatibility of precursor materials or target sources for the desired film composition. Other factors to consider are the ease of operation, maintenance requirements, vacuum system reliability, and any additional features such as in situ monitoring or control options. Consulting with experts or manufacturers can provide valuable guidance in selecting the most suitable thin film deposition equipment for a specific application.

Factors And Parameters That Influence Deposition Of Thin Films

Deposition Rate:

The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.

Uniformity:

The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.

Fill Capability:

Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.

Film Characteristics:

The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.

Process Temperature:

Film characteristics are significantly affected by process temperature, which may be limited by the application.

Damage:

Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.

What Factors Should Be Considered When Selecting A Chemical Vapor Deposition Machine?

Several factors should be considered when selecting a chemical vapor deposition machine. The required film properties, such as composition, thickness, and uniformity, should align with the capabilities of the machine. The size of the deposition chamber should accommodate the desired substrate size and shape. The machine's temperature and pressure range should match the specific deposition requirements. It is also important to consider the availability and compatibility of precursor gases for the desired material deposition. Other considerations include the ease of operation, maintenance requirements, and the level of automation or control capabilities. Additionally, consulting with experts or manufacturers can provide valuable guidance in selecting the most suitable CVD machine for a specific application.

What Safety Considerations Are Associated With Operating Thin Film Deposition Equipment?

Operating thin film deposition equipment requires certain safety considerations to ensure the well-being of operators and prevent potential hazards. Some deposition techniques involve the use of high temperatures, vacuum environments, or toxic gases. Adequate safety protocols should be in place, including proper training for operators, use of personal protective equipment (PPE), and adherence to safety guidelines provided by the equipment manufacturer and regulatory agencies. Proper ventilation systems should be installed to handle any hazardous gases or by-products generated during the deposition process. Emergency shut-off systems, alarms, and interlocks should be implemented to handle unexpected events or equipment malfunctions. Maintenance and periodic inspections should also be conducted to ensure the equipment's safety and functionality. It is crucial to have well-established safety protocols and follow recommended practices to minimize risks associated with thin film deposition equipment operation.

Can Chemical Vapor Deposition Machines Be Used For Multi-layered Thin Film Deposition?

Yes, chemical vapor deposition machines can be used for multi-layered thin film deposition. By controlling the deposition parameters and sequentially introducing different precursor gases, it is possible to deposit multiple layers of different materials onto a substrate. This enables the creation of complex thin film structures with tailored properties and functionalities. The deposition sequence, temperature, pressure, and gas flow rates for each layer can be precisely controlled to achieve the desired film composition and thickness. Multi-layered thin films find applications in various fields, such as microelectronics, optoelectronics, and surface engineering, where different layers serve specific functions or enhance the overall performance of the material system.
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Get your exclusive CVD furnace with KT-CTF16 Customer Made Versatile Furnace. Customizable sliding, rotating, and tilting functions for precise reactions. Order now!

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1200℃ Split Tube Furnace with Quartz Tube Laboratory Tubular Furnace

1200℃ Split Tube Furnace with Quartz Tube Laboratory Tubular Furnace

KT-TF12 split tube furnace: high-purity insulation, embedded heating wire coils, and max. 1200C. Widely used for new materials and chemical vapour deposition.

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1200℃ Controlled Atmosphere Furnace Nitrogen Inert Atmosphere Furnace

1200℃ Controlled Atmosphere Furnace Nitrogen Inert Atmosphere Furnace

Discover our KT-12A Pro Controlled atmosphere furnace - high precision, heavy duty vacuum chamber, versatile smart touch screen controller, and excellent temperature uniformity up to 1200C. Ideal for both laboratory and industrial application.

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