Vacuum Hot Press Furnace
Vacuum hot press furnace
Item Number : KT-VHP
Price varies based on specs and customizations
- Working temperature
- 1500℃ / 2200℃
- Working pressure
- 10-400T
- Press distance
- 100-200mm
- Vacuum pressure
- 6x10-3Pa
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Introduction
Vacuum hot pressing furnace is a complete set of equipment that heats and pressurizes materials under vacuum or atmosphere. According to different materials and heating temperatures, heating elements can be graphite heater, molybdenum heater, and induction heating, etc; and one-way or two-way pressurization can be used for hydraulic pressurization.
Under the high temperature and high pressure and vacuum or atmosphere, the raw material solid particles are bonded with each other, the grains grow up, and the voids (pores) and grain boundaries gradually decrease;Through the transfer of materials, their total volume shrinks, and their density increases, becoming a compact polycrystalline sintered body with a specific microstructure, so that the materials can be pressed and formed.
The density, hardness and other mechanical, electronic and thermal properties of the finished materials can be significantly improved under high temperature and pressure as well as under vacuum or atmosphere
Applications
The Vacuum Tube Hot Press Furnace is a versatile and powerful tool used across various industries for high-temperature processes. This furnace, capable of operating in a vacuum or controlled atmosphere, is particularly suited for applications requiring precise temperature control and a clean environment. Key application areas include:
- Crystal Growth: Ideal for the synthesis and growth of various types of crystals, which are crucial in the electronics and semiconductor industries.
- Heat Treatment: Used for the thermal processing of metals and alloys to enhance their mechanical properties, such as hardness, ductility, and strength.
- Thin Film Deposition: Essential for the deposition of thin films in the manufacturing of electronic devices, solar cells, and optical coatings.
- Materials Science Research: Widely used in laboratories for research on new materials, including ceramics, composites, and advanced alloys.
- Metallurgy: Helps in the purification and alloying of metals, as well as in the production of refractory materials.
- Electronics Manufacturing: Critical for processes like annealing, sintering, and the production of electronic components.
- Chemical Industry: Utilized for high-temperature chemical reactions and the synthesis of chemicals under controlled atmospheres.
- Glass Manufacturing: Useful in the production of specialty glasses and the modification of glass properties through heat treatment.
- Special Materials Production: Involved in the creation of materials with unique properties, such as those used in aerospace and defense.
- Academic and Research Institutions: A staple in university laboratories and research centers for advanced materials research and development.
Detail & Parts
- Double shell structure with water-cooled jacket, the inner shell is made of stainless steel and has been finely polished. Housings are high quality carbon steel with anti-rust treatment or stainless steel with pad blasting.
- The heating element adopts graphite or molybdenum wire. Heating is divided into 1-phase or 3-phase heating. The rational design of the heating element helps to improve the uniformity of the temperature in the cavity.
- The furnace can be easily operated through the electrical control system. The temperature and pressure are controlled by PLC analog, or the sintering process is automatically completed by using a temperature and pressure programmable controller. The control system has alarm and protection functions such as water cut off, over temperature and over current.
Principle
The Vacuum Tube Hot Press Furnace operates by heating and pressurizing materials under vacuum or atmosphere. It utilizes heating elements like graphite or molybdenum heaters and can apply one-way or two-way pressurization. This process bonds raw material particles, reduces voids, and increases density, forming a compact sintered body. The furnace is designed for various industries, ensuring precise heat treatment and material sintering.
Advantages
The Vacuum Tube Hot Press Furnace offers a plethora of advantages that make it a superior choice for various heat treatment processes and applications. Here are some of the key benefits:
- Versatility in Heat Treatment Processes: The furnace supports a wide range of heat treatment processes, making it suitable for various materials and industries. This versatility ensures that it can meet diverse needs in material processing.
- High-Speed Cycles with High-Pressure Gas Quench: The furnace is designed to facilitate high-speed cycles, which are essential for efficient production. The high-pressure gas quench feature enhances the cooling process, leading to faster cycle times and increased productivity.
- Energy and Resource Efficiency: With low consumption of energy and process gases, the furnace is environmentally friendly and cost-effective. This efficiency not only reduces operational costs but also minimizes the environmental footprint.
- Environmentally Friendly with Low Emissions: The design of the furnace ensures low emissions of process gases, making it an eco-conscious choice for industries looking to minimize their environmental impact.
- Simple and Modular Design: The simple design of the furnace allows for easy installation and maintenance. Its modular nature means it can be fitted and adjusted to specific tasks and plant conditions, ensuring optimal performance.
- Guaranteed Quality and Repeatable Process Resul: The furnace is engineered to deliver guaranteed quality and repeatable process results, which is crucial for industries where precision and consistency are paramount.
- Predictive Maintenance: Advanced features such as predictive maintenance help in identifying potential issues before they escalate, ensuring minimal downtime and prolonging the lifespan of the equipment.
Structure introduction
This electric furnace has two types of graphite heating and resistance wire heating, which are suitable for sintering metal powder, inorganic non-metallic materials, etc. under vacuum and hh temperature hot pressing; of course, hot pressing sintering can also be carried out under protective atmosphere. In this way, the densification of the material can be completed, deformation can be prevented, and the grain size of the nanopowder can be suppressed.
| Specification |
|
|---|---|
| Furnace shell |
|
| Stove side |
|
| The heating element |
|
| The insulation layer |
|
| The vacuum system |
|
| The main circuit of the electric control system |
|
Features
- Double layer SUS304 stainless steel vacuum chamber structure, jacket cold water circulating cooling method to keep the furnace surface temperature
- Double column supporting structure, stable hydraulic press system,pressure can be manual control or automatic control,precise pressure regulating and maintaining
- Advanced thermal insulation materials with low thermal conductivity and good thermal insulation effect, which can effectively isolate heat and reduce energy consumption
- The temperature range is wide. A variety of heating elements can be selected, such as graphite, molybdenum, tungsten, induction heating, etc. The temperature can reach 2800 ℃ in a suitable protective atmosphere, which can adapt to hot pressing sintering of different materials;
- Diversified vacuum system configuration, different vacuum degrees are selected according to the process;
- A charging and discharging system is provided, which can be used for hot pressing sintering in vacuum environment, inert atmosphere or reducing atmosphere;
- Humanized configuration, both manual operation and intelligent operation can be realized;
- One furnace for multiple purposes can be used as a simple vacuum or atmosphere sintering furnace;
- Diversified optional functional types available, vertical upper discharge, vertical side outlet discharge, one-way pressurization, two-way pressurization, etc.
Technical specifications
| Working temperature | 1500℃ / 2200℃ |
|---|---|
| Heating element | Molybdenum/Graphite |
| Working pressure | 10-400T |
| Press distance | 100-200mm |
| Vacuum pressure | 6x10-3Pa |
| Effective working area diameter range | 90-600mm |
| Effective working area diameter range | 120-600mm |
Warnings
Operator safety is the top important issue! Please operate the equipment with cautions. Working with inflammable& explosive or toxic gases is very dangerous, operators must take all necessary precautions before starting the equipment. Working with positive pressure inside the reactors or chambers is dangerous, operator must fellow the safety procedures strictly. Extra caution must also be taken when operating with air-reactive materials, especially under vacuum. A leak can draw air into the apparatus and cause a violent reaction to occur.
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FAQ
What Is A Vacuum Furnace Used For?
What Is CVD Furnace?
Chemical vapor deposition (CVD) is a technology that uses various energy sources such as heating, plasma excitation or light radiation to chemically react gaseous or vapor chemical substances on the gas phase or gas-solid interface to form solid deposits in the reactor by means of chemical reaction.To put it simply, two or more gaseous raw materials are introduced into a reaction chamber, and then they react with each other to form a new material and deposit it on the substrate surface.
CVD furnace is one combined furnace system with high temperature tube furnace unit,gases control unit, and vacuum unit, it is widely used for experiment and production of composite material preparation, microelectronics process, semiconductor optoelectronic, solar energy utilization, optical fiber communication, superconductor technology, protective coating field.
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What Is The Purpose Of A Vacuum Hot Press Furnace?
What Is The Process Of A Vacuum Furnace?
How Does CVD Furnace Work?
CVD furnace system consists of high temperature tube furnace unit, reacting gas source precise control unit, vacuum pump station and corresponding assembling parts.
Vacuum pump is to remove the air from the reacting tube,and make sure there is no unwanted gases inside the reaction tube, after that the tube furnace will heat the reaction tube to a target temperature, then reacting gas source precise control unit can introduce different gases with a set ratio into the furnace tube for the chemical reaction, the chemical vapor deposition will be formed in the CVD furnace.
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What Is PECVD Method?
What Are The Advantages Of A Vacuum Hot Press Furnace?
What Gas Is Used In A Vacuum Furnace?
Which Gas Is Used In CVD Process?
There are tremendous gas sources can be used in the CVD process, the common chemical reactions of CVD includes Pyrolysis, photolysis, reduction, oxidation, redox,so the gases involved in these chemical reactions can be used in the CVD process.
We take CVD Graphene growth for an example, the gases used in the CVD process will be CH4,H2,O2 and N2.
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What Is PECVD Used For?
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What Is The Heating Element Used In A Vacuum Furnace?
What Is The Advantage Of CVD System?
- Wide range of films can be produced, metal film, nonmetal film and multi-component alloy film as required. At the same time, it can prepare high-quality crystals that are difficult to obtain by other methods, such as GaN, BP, etc.
- The film forming speed is fast, usually several microns per minute or even hundreds of microns per minute. It is possible to simultaneously deposit large quantities of coatings with uniform composition, which is incomparable to other film preparation methods, such as liquid phase epitaxy (LPE) and molecular beam epitaxy (MBE).
- The working conditions are carried out under normal pressure or low vacuum conditions, so the coating has good diffraction, and the workpieces with complex shapes can be uniformly coated, which is much superior to PVD.
- Due to the mutual diffusion of reaction gas, reaction product and substrate, a coating with good adhesion strength can be obtained, which is crucial for preparing surface strengthened films such as wear-resistant and anti-corrosion films.
- Some films grow at a temperature far lower than the melting point of the film material. Under the condition of low temperature growth, the reaction gas and reactor wall and impurities contained in them almost do not react, so a film with high purity and good crystallinity can be obtained.
- Chemical vapor deposition can obtain a smooth deposition surface. This is because compared with LPE, chemical vapor deposition (CVD) is carried out under high saturation, with high nucleation rate, high nucleation density, and uniform distribution on the whole plane, resulting in a macroscopic smooth surface. At the same time, in chemical vapor deposition, the average free path of molecules (atoms) is much larger than LPE, so the spatial distribution of molecules is more uniform, which is conducive to the formation of a smooth deposition surface.
- Low radiation damage, which is a necessary condition for manufacturing metal oxide semiconductors (MOS) and other devices
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What Does PECVD Stand For?
PECVD is a technology that uses plasma to activate reaction gas, promote chemical reaction on the surface of substrate or near surface space, and generate solid film. The basic principle of plasma chemical vapor deposition technology is that under the action of RF or DC electric field, the source gas is ionized to form a plasma, the low-temperature plasma is used as the energy source, an appropriate amount of reaction gas is introduced, and the plasma discharge is used to activate the reaction gas and realize chemical vapor deposition.
According to the method of generating plasma, it can be divided into RF plasma, DC plasma and microwave plasma CVD, etc...
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What Is The Difference Between CVD And PECVD?
The difference between PECVD and traditional CVD technology is that the plasma contains a large number of high-energy electrons, which can provide the activation energy required in the chemical vapor deposition process, thus changing the energy supply mode of the reaction system. Since the electron temperature in the plasma is as high as 10000K, the collision between electrons and gas molecules can promote the chemical bond breaking and recombination of the reaction gas molecules to generate more active chemical groups, while the whole reaction system maintains a lower temperature.
So compared to the CVD process, PECVD can carry out the same chemical vapor deposition process with a lower temperature.
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4.9
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The Vacuum hot press furnace is a remarkable piece of equipment. Its technological advancements have revolutionized our research capabilities.
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