Cathode sputtering is a process used in thin film deposition.
In this process, a solid target is bombarded by high-energy ions.
This is achieved by creating a glow discharge between two electrodes within a rarefied atmosphere under vacuum conditions.
The two electrodes are the target (cathode) and the substrate (anode).
A DC field is applied to create a discharge between the electrodes.
By introducing an inert gas, usually argon, a plasma is formed through the ionization of the gas.
The positively charged argon ions are then accelerated towards the negatively charged target (cathode), resulting in the sputtering of cathode material.
The sputtered material, in the form of atoms or molecules, is then deposited onto the substrate, forming a thin film or coating.
The thickness of the deposited material typically ranges from 0.00005 to 0.01 mm.
Common materials used as target deposits include chromium, titanium, aluminum, copper, molybdenum, tungsten, gold, and silver.
Sputtering is an etching process that alters the physical properties of a surface.
It can be used for various applications, including coating substrates for electrical conductivity, reducing thermal damage, enhancing secondary electron emission, and providing thin films for scanning electron microscopy.
The sputtering technique involves introducing a controlled gas, usually argon, into a vacuum chamber.
The cathode, or target, is electrically energized to generate a self-sustaining plasma.
The gas atoms within the plasma become positively charged ions by losing electrons and are then accelerated towards the target.
The impact dislocates atoms or molecules from the target material, creating a vapor stream.
This sputtered material passes through the chamber and deposits onto the substrate as a film or coating.
In a sputtering system, the cathode is the target of the gaseous discharge, and the substrate acts as the anode.
Energetic ions, typically argon ions, bombard the target, causing the ejection of target atoms.
These atoms then impinge on the substrate, forming a coating.
DC sputtering is a specific type of cathode sputtering that utilizes a DC gaseous discharge.
The target serves as the deposition source, the substrate and vacuum chamber walls may act as the anode, and the power supply is a high-voltage DC source.
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