An example of sputtering is the process by which atoms are ejected from a solid target material due to bombardment by high-energy particles. This can be demonstrated in various applications, such as the deposition of thin film materials for manufacturing high-quality reflective coatings, semiconductor devices, and nanotechnology products.
In the sputtering process, high-energy particles, such as ions created by particle accelerators, radio frequency magnetrons, plasma, ion sources, alpha radiation from radioactive materials, and solar wind from space, collide with target atoms on the surface of solids. These collisions exchange momentum, triggering collision cascades in the adjacent particles. When the energy of these collision cascades is greater than the surface target binding energy, an atom is ejected from the surface, a phenomenon known as sputtering.
Sputtering can be done using direct current (DC sputtering) with voltages of 3-5 kV or alternating current (RF sputtering) with frequencies around the 14 MHz range. This technique is widely used in various industries, such as the production of reflective coatings for mirrors and potato chip bags, semiconductor devices, and optical coatings.
One specific example of sputtering is the use of radio frequency magnetron to deposit two-dimensional materials in glass substrates, which is used to study the effect on thin films with applications in solar cells. Magnetron sputtering is an environmentally friendly technique that allows the deposition of small quantities of oxides, metals, and alloys on different substrates.
In summary, sputtering is a versatile and mature process with numerous applications in science and industry, enabling the precise etching, analytical techniques, and deposition of thin film layers in the manufacture of various products, such as optical coatings, semiconductor devices, and nanotechnology products.
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