Sputtering coating is a method used to apply thin, functional layers onto a substrate. This is done through a physical vapor deposition technique. The process involves high-energy particles knocking atoms out of a target material. These atoms then settle onto a substrate, forming a strong bond at the atomic level.
3 Key Steps Explained
1. Preparation of the Environment
The process starts by evacuating a chamber to remove all molecules. Then, the chamber is filled with a specific gas like argon, oxygen, or nitrogen. The choice of gas depends on the material to be deposited.
2. Activation of the Sputtering Process
A negative electrical potential is applied to the target material. The chamber body serves as the positive anode. This setup creates a plasma discharge in the chamber.
3. Ejection and Deposition of Material
High-energy particles hit the target material, causing atoms to be ejected. These atoms travel across the vacuum chamber and deposit onto the substrate as a thin film.
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