ALD can achieve conformal deposition due to its unique process and characteristics.
Firstly, ALD relies on self-limiting reactions between gaseous reactants and the solid surface. This means that the reactions are controlled in a way that only a monolayer of material is deposited at a time. The reactants are introduced into the reactor one at a time, and they react with the surface until all reactive sites are occupied. This self-limiting nature ensures that the deposition process stops once the surface is fully covered, resulting in a conformal coating.
Secondly, ALD offers precise thickness control at the submonolayer level. The reactants are pulsed into the chamber alternately, never present simultaneously. This controlled pulsing allows for accurate control over the thickness of the deposited film. By adjusting the number of cycles, the thickness of the film can be precisely controlled, enabling uniform and conformal deposition.
Thirdly, ALD provides excellent step coverage. Step coverage refers to the ability of a deposition process to uniformly coat surfaces with complex geometries, including high aspect ratio topographies and curved surfaces. ALD is highly effective at coating such surfaces due to its ability to deposit films uniformly and conformally, even onto curved substrates. This makes ALD suitable for a wide range of applications, including semiconductor engineering, MEMS, catalysis, and nanotechnology.
Lastly, ALD ensures high reproducibility and film quality. The self-limiting and self-assembled nature of the ALD mechanism leads to stoichiometric control and inherent film quality. The precise control over the deposition process and the use of pure substrates contribute to the desired film properties. This makes ALD a reliable method for producing highly uniform and conformal nano-thin films.
In summary, ALD achieves conformal deposition through self-limiting reactions, precise thickness control, excellent step coverage, and high reproducibility. These characteristics make ALD a powerful technique for depositing highly conformal coatings, even on complex geometries and curved surfaces.
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