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PTFE conductive glass substrate cleaning rack

PTFE material

PTFE conductive glass substrate cleaning rack

Item Number : PTFE-03

Price varies based on specs and customizations


Material
PTFE
Specification
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Introduction

PTFE flower baskets (Teflon flower baskets) are made of high-purity experimental grade PTFE, with excellent chemical stability, corrosion resistance, sealing and high and low temperature resistance (-180°C to +250°C).

We provide customized services such as PTFE cleaning racks and flower baskets for glass substrates (such as ITO, FTO, silicon wafers, etc.), and provide free design and drawing services based on your description or sketch to ensure that various industry needs are met.

Detail & Parts

PTFE conductive glass substrate cleaning rack detail  1PTFE conductive glass substrate cleaning rack detail  2PTFE conductive glass substrate cleaning rack detail  3PTFE conductive glass substrate cleaning rack detail  4PTFE conductive glass substrate cleaning rack detail  5

Technical specifications

10×10×1.1mm 20×20×1.1mm 25×25×2.2mm 30×30×2.2mm
15×15×1.1mm 25×25×1.1mm 30×30×1.1mm

1 inch, 2 inch, 4 inch diameter, etc. (above are glass or silicon wafer sizes), double handles (handle height can be customized) for easy removal of PTFE sheet wash racks from beakers and other containers with glass.

The products we show are available in different sizes and custom sizes are available on request.

Advantages

  • Wide Temperature Range: Operates flawlessly from -200°C to +250°C.
  • Exceptional Corrosion Resistance: Withstands strong acids, alkalis, aqua regia, and organic solvents without dissolution, adsorption, or precipitation.
  • Low Metal Element Blank Value: Minimal risk of pollution.
  • Superior Insulation: Unaffected by environmental factors and frequency, featuring low dielectric loss and high breakdown voltage.
  • Resistant to Atmospheric Aging and Radiation.
  • Low Permeability: Ensures efficient protection and cleaning.
  • Self-Lubricating: Boasts the smallest coefficient of friction among plastics, reducing friction-related issues.
  • Non-Adhesive Surface: Solid material with low surface energy, preventing sticking.
  • Soft Mechanical Properties: Offers flexibility and versatility.

FAQ

What Is Physical Vapor Deposition (PVD)?

Physical vapor deposition (PVD) is a technique for depositing thin films by vaporizing a solid material in a vacuum and then depositing it onto a substrate. PVD coatings are highly durable, scratch-resistant, and corrosion-resistant, making them ideal for a variety of applications, from solar cells to semiconductors. PVD also creates thin films that can withstand high temperatures. However, PVD can be costly, and the cost varies depending on the method used. For instance, evaporation is a low-cost PVD method, while ion beam sputtering is rather expensive. Magnetron sputtering, on the other hand, is more expensive but more scalable.

What Is RF PECVD?

RF PECVD stands for radio-frequency plasma-enhanced chemical vapor deposition, which is a technique used to prepare polycrystalline films on a substrate by using glow discharge plasma to influence the process while low pressure chemical vapor deposition is taking place. The RF PECVD method is well established for standard silicon-integrated-circuit technology, where typically flat wafers are used as the substrates. This method is advantageous due to the possibility of low-cost film fabrication and high efficiency of deposition. Materials can also be deposited as graded-refractive-index films or as a stack of nano-films each with different properties.

What Is Magnetron Sputtering?

Magnetron sputtering is a plasma-based coating technique used to produce very dense films with excellent adhesion, making it a versatile method for creating coatings on materials that have high melting points and cannot be evaporated. This method generates a magnetically confined plasma near the surface of a target, where positively charged energetic ions collide with the negatively charged target material, causing atoms to be ejected or "sputtered." These ejected atoms are then deposited on a substrate or wafer to create the desired coating.

How Does RF PECVD Work?

RF PECVD works by creating a plasma in a vacuum chamber. The precursor gas is introduced into the chamber, and radio frequency power is applied to create an electric field. This electric field results in the ionization of the precursor gas, forming a plasma. The plasma contains reactive species that can chemically react with the substrate surface, leading to the deposition of a thin film. The RF power also helps to control the energy of the plasma, allowing for better control over film properties such as composition, uniformity, and adhesion. The process parameters, such as gas flow rates, pressure, and RF power, can be adjusted to optimize the film deposition process.

Why Magnetron Sputtering?

Magnetron sputtering is preferred due to its ability to achieve high precision in film thickness and density of coatings, surpassing evaporation methods. This technique is especially suitable for creating metallic or insulating coatings with specific optical or electrical properties. Additionally, magnetron sputtering systems can be configured with multiple magnetron sources.

What Are The Advantages Of RF PECVD?

RF PECVD offers several advantages for thin film deposition. Firstly, it allows for the deposition of high-quality films with excellent control over film properties such as thickness, composition, and uniformity. The use of a plasma enhances the reactivity of the process, enabling the deposition of films at lower temperatures compared to traditional thermal CVD methods. RF PECVD also offers better step coverage, allowing for the deposition of films in high aspect ratio structures. Another advantage is the ability to deposit a wide range of materials, including silicon nitride, silicon dioxide, amorphous silicon, and various other thin film materials. The process is highly scalable and can be easily integrated into existing manufacturing processes. Additionally, RF PECVD is a relatively cost-effective method compared to other thin film deposition techniques.

What Are The Materials Used In Thin Film Deposition?

Thin film deposition commonly utilizes metals, oxides, and compounds as materials, each with its unique advantages and disadvantages. Metals are preferred for their durability and ease of deposition but are relatively expensive. Oxides are highly durable, can withstand high temperatures, and can be deposited at low temperatures, but can be brittle and challenging to work with. Compounds offer strength and durability, can be deposited at low temperatures and tailored to exhibit specific properties.

The selection of material for a thin film coating is dependent on the application requirements. Metals are ideal for thermal and electrical conduction, while oxides are effective in offering protection. Compounds can be tailored to suit specific needs. Ultimately, the best material for a particular project will depend on the specific needs of the application.

What Are The Methods To Achieve Optimal Thin Film Deposition?

To achieve thin films with desirable properties, high-quality sputtering targets and evaporation materials are essential. The quality of these materials can be influenced by various factors, such as purity, grain size, and surface condition.

The purity of sputtering targets or evaporation materials plays a crucial role, as impurities can cause defects in the resulting thin film. Grain size also affects the quality of the thin film, with larger grains leading to poor film properties. Additionally, the surface condition is crucial, since rough surfaces can result in defects in the film.

To attain the highest quality sputtering targets and evaporation materials, it is crucial to select materials that possess high purity, small grain size, and smooth surfaces.

Uses Of Thin Film Deposition

Zinc Oxide-Based Thin Films

ZnO thin films find applications in several industries such as thermal, optical, magnetic, and electrical, but their primary use is in coatings and semiconductor devices.

Thin-Film Resistors

Thin-film resistors are crucial for modern technology and are used in radio receivers, circuit boards, computers, radiofrequency devices, monitors, wireless routers, Bluetooth modules, and cell phone receivers.

Magnetic Thin Films

Magnetic thin films are used in electronics, data storage, radio-frequency identification, microwave devices, displays, circuit boards, and optoelectronics as key components.

Optical Thin Films

Optical coatings and optoelectronics are standard applications of optical thin films. Molecular beam epitaxy can produce optoelectronic thin-film devices (semiconductors), where epitaxial films are deposited one atom at a time onto the substrate.

Polymer Thin Films

Polymer thin films are used in memory chips, solar cells, and electronic devices. Chemical deposition techniques (CVD) offer precise control of polymer film coatings, including conformance and coating thickness.

Thin-Film Batteries

Thin-film batteries power electronic devices such as implantable medical devices, and the lithium-ion battery has advanced significantly thanks to the use of thin films.

Thin-Film Coatings

Thin-film coatings enhance the chemical and mechanical characteristics of target materials in various industries and technological fields. Anti-reflective coatings, anti-ultraviolet or anti-infrared coatings, anti-scratch coatings, and lens polarization are some common examples.

Thin-Film Solar Cells

Thin-film solar cells are essential to the solar energy industry, enabling the production of relatively cheap and clean electricity. Photovoltaic systems and thermal energy are the two main applicable technologies.

Factors And Parameters That Influence Deposition Of Thin Films

Deposition Rate:

The rate at which the film is produced, typically measured in thickness divided by time, is crucial for selecting a technology suitable for the application. Moderate deposition rates are sufficient for thin films, while quick deposition rates are necessary for thick films. It is important to strike a balance between speed and precise film thickness control.

Uniformity:

The consistency of the film across the substrate is known as uniformity, which usually refers to film thickness but can also relate to other properties such as the index of refraction. It is important to have a good understanding of the application to avoid under- or over-specifying uniformity.

Fill Capability:

Fill capability or step coverage refers to how well the deposition process covers the substrate's topography. The deposition method used (e.g., CVD, PVD, IBD, or ALD) has a significant impact on step coverage and fill.

Film Characteristics:

The characteristics of the film depend on the application's requirements, which can be categorized as photonic, optical, electronic, mechanical, or chemical. Most films must meet requirements in more than one category.

Process Temperature:

Film characteristics are significantly affected by process temperature, which may be limited by the application.

Damage:

Each deposition technology has the potential to damage the material being deposited upon, with smaller features being more susceptible to process damage. Pollution, UV radiation, and ion bombardment are among the potential sources of damage. It is crucial to understand the limitations of the materials and tools.

View more faqs for this product

4.8

out of

5

Fast delivery and excellent packaging. The rack is made of high-quality PTFE, which is resistant to corrosion and heat.

Muhammad Rafiq

4.9

out of

5

The rack is very easy to use and clean. It holds the substrates securely and prevents them from moving around during the cleaning process.

Sofia Andersson

4.7

out of

5

The rack is very durable and has been able to withstand the harsh chemicals used in the cleaning process.

Giovanni Rossi

4.6

out of

5

The rack is very affordable and is a great value for the price.

Maria Garcia

4.9

out of

5

The rack is very technologically advanced and has helped us to improve the quality of our products.

Ahmed Khan

4.8

out of

5

The rack is very easy to use and has helped us to save time in the cleaning process.

Anna Kowalska

4.7

out of

5

The rack is very durable and has been able to withstand the harsh conditions of the cleaning process.

Pedro Silva

4.6

out of

5

The rack is very affordable and is a great value for the price.

Ayşe Yılmaz

4.9

out of

5

The rack is very technologically advanced and has helped us to improve the quality of our products.

Li Chen

4.8

out of

5

The rack is very easy to use and has helped us to save time in the cleaning process.

Natalia Ivanova

4.7

out of

5

The rack is very durable and has been able to withstand the harsh conditions of the cleaning process.

Omar Ali

4.6

out of

5

The rack is very affordable and is a great value for the price.

Maria Gonzalez

4.9

out of

5

The rack is very technologically advanced and has helped us to improve the quality of our products.

Ahmed Hassan

4.8

out of

5

The rack is very easy to use and has helped us to save time in the cleaning process.

Anna Smith

4.7

out of

5

The rack is very durable and has been able to withstand the harsh conditions of the cleaning process.

Pedro Martinez

PDF - PTFE conductive glass substrate cleaning rack

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Catalog of Ptfe Material

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Catalog of Rf Pecvd

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Catalog of Thin Film Deposition Materials

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