Sputtering is a versatile technique used in various industries for material deposition. There are several types of sputtering techniques, each with unique characteristics and advantages.
4 Key Types of Sputtering Techniques
1. Direct Current (DC) Magnetron Sputtering
Direct Current (DC) Magnetron Sputtering is one of the most common methods. In this method, a direct current power supply is used to generate a plasma in a low-pressure gas environment.
The plasma is created near a target material, typically made of metal or ceramic, which is to be sputtered. The plasma causes gas ions to collide with the target, dislodging atoms from the surface and ejecting them into the gas phase.
The magnetic field produced by the magnet assembly helps increase the sputtering rate and ensures a more uniform deposition of the sputtered material onto the substrate.
The sputtering rate can be calculated using a specific formula that considers factors such as ion flux density, number of target atoms per unit volume, atomic weight of the target material, and more.
2. Reactive Sputtering
Reactive Sputtering involves the combination of a non-inert gas, such as oxygen, and an elemental target material, such as silicon. The gas chemically reacts with the sputtered atoms within the chamber, generating a new compound that serves as the coating material rather than the original pure target material.
This technique is particularly useful for creating specific chemical compounds in the deposition process.
3. Radio Frequency (RF) Sputtering
Radio Frequency (RF) Sputtering is another common method. It uses radio frequency power to generate the plasma, making it suitable for non-conductive target materials.
4. High-Power Impulse Magnetron Sputtering (HiPIMS)
High-Power Impulse Magnetron Sputtering (HiPIMS) is a newer technique that uses short, high-power pulses to achieve higher plasma densities and better film properties.
Continue Exploring, Consult Our Experts
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