Knowledge What are the challenges of silicon carbide?
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Tech Team · Kintek Solution

Updated 1 week ago

What are the challenges of silicon carbide?

Silicon carbide (SiC) presents several challenges despite its advantageous properties such as high thermal conductivity, low thermal expansion, and exceptional hardness. The primary challenges include the difficulty in fabrication, sensitivity to thermal shock, and the need for specialized processing techniques.

Fabrication Difficulties: Silicon carbide is extremely hard, which makes it challenging to fabricate into precision parts. Traditional machining methods are not effective due to the material's hardness. As mentioned, the fabrication of precision parts from CVD SiC must be completed via diamond grinding technologies. This process is not only time-consuming but also expensive due to the high cost of diamond tools and the energy required for grinding. Additionally, the electrical properties of SiC, particularly its low electrical resistance, necessitate the use of specialized techniques like electrical discharge machining (EDM) for creating fine features. This adds to the complexity and cost of manufacturing SiC components.

Thermal Shock Sensitivity: Although SiC has high thermal conductivity (120-270 W/mK) and low thermal expansion (4.0x10-6/°C), which generally contribute to its thermal shock resistance, rapid temperature changes can still induce thermal stresses leading to microcracks. This sensitivity to thermal shock requires careful consideration in applications involving rapid heating or cooling. The protective silicon oxide coating that forms at high temperatures can help mitigate this issue, but it is not a complete solution. Engineers must design components with gradual temperature transitions to prevent damage, which can limit the operational flexibility of SiC components.

Specialized Processing Techniques: The unique properties of SiC require specialized processing techniques. For instance, the chemical vapor deposition (CVD) method is used to produce SiC with specific electrical properties. This process is complex and requires precise control of temperature, pressure, and gas composition, making it a high-cost production method. Moreover, the use of EDM and diamond grinding for fabrication demands skilled operators and sophisticated machinery, further increasing the cost and complexity of SiC production.

In summary, while silicon carbide offers numerous benefits such as high thermal conductivity, low thermal expansion, and exceptional hardness, these very properties also present significant challenges in terms of fabrication, thermal shock sensitivity, and the need for specialized processing techniques. These factors contribute to the high cost and complexity of working with SiC, necessitating careful consideration of its use in various applications.

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