The frequency commonly used for RF sputter deposition is 13.56 MHz. This frequency is chosen for several reasons:
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Regulatory Compliance: The International Telecommunication Union (ITU) has designated 13.56 MHz as a frequency for industrial, scientific, and medical (ISM) instruments to prevent interference with telecommunication services. This allocation ensures that RF sputtering equipment operates within a frequency band that is specifically reserved for non-communication applications.
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Efficiency in Ion-Target Interaction: The frequency of 13.56 MHz is low enough to allow sufficient time for the momentum transfer of argon ions to the target material during sputtering. At this frequency, the ions have enough time to reach and interact with the target before the next cycle of the RF field begins. This interaction is crucial for effective sputtering of the target material.
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Avoidance of Charge Build-up: In RF sputtering, the alternating electrical potential helps in preventing charge build-up on the target, especially when dealing with insulating materials. During the positive cycle of the RF, electrons are attracted to the target, giving it a negative bias. During the negative cycle, ion bombardment continues, ensuring that the target remains electrically neutral and preventing any adverse effects such as droplet formation.
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Widely Accepted Standard: Given its effectiveness and compliance with international regulations, 13.56 MHz has become the standard frequency for RF sputtering. This standardization simplifies the design and operation of sputtering equipment, as well as the compatibility of different systems and components.
In summary, the choice of 13.56 MHz for RF sputter deposition is a result of its regulatory compliance, efficiency in ion-target interactions, ability to prevent charge build-up, and its status as a widely accepted standard in the industry.
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