In Physical Vapor Deposition (PVD), gases play a crucial role in the formation of various compounds that enhance the properties of the substrate material.
Top 3 Gases Used in PVD: Oxygen, Nitrogen, and Methane
Oxygen
Oxygen is commonly used in the PVD process.
It reacts with metal atoms to form metal oxides.
This reaction occurs during the transport phase.
The formation of metal oxides is essential for applications requiring oxidation resistance and improved hardness.
Nitrogen
Nitrogen is another key gas used in PVD.
It is particularly important in processes like sputtering.
The target material is often a metal like titanium.
The reaction between nitrogen and titanium leads to the formation of titanium nitride (TiN).
TiN is a hard, wear-resistant compound.
This reaction is enhanced by the presence of nitrogen gas in the plasma environment.
Methane
Methane is used in PVD processes to form carbides.
It is particularly effective when the target material is a metal that can form stable carbides.
The reaction between methane and metal atoms results in the deposition of metal carbides.
Metal carbides are known for their hardness and wear resistance.
This gas is typically used in specific applications where carbide formation is beneficial.
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