Products Thermal Equipment CVD & PECVD Furnace Chemical Vapor Deposition CVD Equipment System Chamber Slide PECVD Tube Furnace with Liquid Gasifier PECVD Machine
Chemical Vapor Deposition CVD Equipment System Chamber Slide PECVD Tube Furnace with Liquid Gasifier PECVD Machine

CVD & PECVD Furnace

Chemical Vapor Deposition CVD Equipment System Chamber Slide PECVD Tube Furnace with Liquid Gasifier PECVD Machine

Item Number : KT-PE12

Price varies based on specs and customizations


Max. temperature
1200 ℃
Constant work temperature
1100 ℃
Furnace tube diameter
60 mm
Heating zone length
1x450 mm
Heating rate
0-20 ℃/min
Sliding distance
600mm
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Introduction

The Slide PECVD Tube Furnace With Liquid Gasifier PECVD Machine is a versatile and high-performance system designed for a wide range of thin film deposition applications. It features a 500W RF plasma source, slide-out furnace, precise gas flow control, and a vacuum station. The system offers advantages such as automatic plasma matching, high-speed heating and cooling, programmable temperature control, and a user-friendly interface. It is widely used in research and production environments for depositing thin films in various industries, including electronics, semiconductors, and optics.

Applications

Slide PECVD Tube Furnace With Liquid Gasifier PECVD Machine finds its applications in:

  • Chemical Vapor Deposition (CVD)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • Thin film deposition
  • Solar cell fabrication
  • Semiconductor processing
  • Nanotechnology
  • Materials science
  • Research and development

Different temperature and setup CVD systems available

PECVD front

PECVD side

PECVD side

PECVD local

PECVD local

Principle

The Slide PECVD Tube Furnace With Liquid Gasifier PECVD Machine employs low-temperature plasma to generate a glow discharge in the process chamber's cathode (sample tray). The glow discharge (or another heat source) raises the sample's temperature to a predetermined level. Then, controlled amounts of process gas are introduced, undergoing chemical and plasma reactions to form a solid film on the sample's surface.

Features

The Slide PECVD Tube Furnace With Liquid Gasifier PECVD Machine offers numerous benefits to users:

  • Enhanced power generation for solar cell wafers: The innovative graphite boat structure significantly improves the power output of solar cells.
  • Elimination of color difference in tubular PECVD cells: This equipment effectively addresses the issue of color variation in tubular PECVD cells.
  • Wide output power range (5-500W): The RF plasma automatic matching source provides a versatile range of output power, ensuring optimal performance for various applications.
  • High-speed heating and cooling: The furnace chamber sliding system enables rapid heating and cooling, reducing processing time. Auxiliary forced air circulation further accelerates the cooling rate.
  • Automated sliding movement: The optional sliding movement feature allows for automatic operation, enhancing efficiency and reducing manual intervention.
  • Precise temperature control: PID programmable temperature control ensures accurate temperature regulation, supporting remote and centralized control for added convenience.
  • High-accuracy MFC mass flowmeter control: The MFC mass flowmeter precisely controls source gases, ensuring a stable and consistent gas supply.
  • Versatile vacuum station: The stainless steel vacuum flange with multiple adapting ports accommodates various vacuum pump station configurations, ensuring a high vacuum degree.
  • User-friendly interface: The CTF Pro 7-inch TFT touch screen controller simplifies program setting and allows for easy analysis of historical data.

Advantages

  • RF plasma automatic matching source, wide 5-500W output power range stable output
  • Furnace chamber sliding system for high speed heating and short time cooling, auxiliary fast cooling and automatic sliding movement are available
  • PID programmable temperature control,excellent control accuracy and support remote control and centralized control 
  • High accuracy MFC mass flowmeter control, source gases premixing and stable gas supply speed
  • Stainless steel vacuum flange with various adapting port to meet different vacuum pump station setup, good sealing and high vacuum degree
  • CTF Pro applies one 7 inches TFT touch screen controller, more friendly program setting and history data analysis

Safety Advantage

  • Kindle Tech tube furnace owns over current protection and over temperature alarming function, furnace will turn off the power automatically
  • Furnace build in thermal couple detecting function, furnace will stop heating and alarm will be on once broken or failure detected
  • PE Pro support power failure restarting function,furnace will resume the furnace heating program when power is incoming after failure

Technical specifications

Furnace model KT-PE12-60
Max. temperature 1200℃
Constant work temperature 1100℃
Furnace tube material High purity quartz
Furnace tube diameter 60mm
Heating zone length 1x450mm
Chamber material Japan alumina fiber
Heating element Cr2Al2Mo2 wire coil
Heating rate 0-20℃/min
Thermal couple Build in K type
Temperature controller Digital PID controller/Touch screen PID controller
Temperature control accuracy ±1℃
Sliding distance 600mm
RF Plasma unit
Output Power  5 -500W adjustable with ± 1% stability
RF frequency 13.56 MHz ±0.005% stability
Reflection Power 350W max.
Matching Automatic
Noise <50 dB
Cooling Air cooling.
Gas precise control unit
Flow meter MFC mass flow meter
Gas channels 4 channels
Flow rate MFC1: 0-5SCCM O2
MFC2: 0-20SCMCH4
MFC3: 0- 100SCCM H2
MFC4: 0-500 SCCM N2
Linearity ±0.5% F.S.
Repeatability ±0.2% F.S.
 Pipe line and valve Stainless steel
Maximum Operating Pressure 0.45MPa
Flow meter controller Digital Knob controller/Touch screen controller
Standard vacuum unit(Optional)
Vacuum pump Rotary vane vacuum pump
Pump flow rate 4L/S
Vacuum suction port KF25
Vacuum gauge Pirani/Resistance silicon vacuum gauge
Rated vacuum pressure 10Pa
High vacuum unit(Optional)
Vacuum pump Rotary vane pump+Molecular pump
Pump flow rate 4L/S+110L/S
Vacuum suction port KF25
Vacuum gauge Compound vacuum gauge
Rated vacuum pressure 6x10-4Pa
Above specifications and setups can be customized

Standard Package

No. Description Quantity
1 Furnace 1
2 Quartz tube 1
3 Vacuum flange 2
4 Tube thermal block 2
5 Tube thermal block hook 1
6 Heat resistant glove 1
7 RF plasma source 1
8 Precise gas control 1
9 Vacuum unit 1
10 Operation manual 1

Optional Setup

  • In tube gases detecting and monitoring,like H2, O2 and so on
  • Independent furnace temperature monitoring and recording
  • RS 485 communication port for PC remote control and data exporting
  • Insert gases feeding flow rate control,like mass flowmeter and float flowmeter
  • Touch screen temperature controller with versatile operator friendly functions
  • High vacuum pump station setups, like vane vacuum pump,molecular pump,diffusion pump

Warnings

Operator safety is the top important issue! Please operate the equipment with cautions. Working with inflammable& explosive or toxic gases is very dangerous, operators must take all necessary precautions before starting the equipment. Working with positive pressure inside the reactors or chambers is dangerous, operator must fellow the safety procedures strictly. Extra caution must also be taken when operating with air-reactive materials, especially under vacuum. A leak can draw air into the apparatus and cause a violent reaction to occur.

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FAQ

What Is PECVD Method?

PECVD (Plasma Enhanced Chemical Vapor Deposition) is a process used in semiconductor manufacturing to deposit thin films on microelectronic devices, photovoltaic cells, and display panels. In PECVD, a precursor is introduced to the reaction chamber in a gaseous state, and the assistance of plasma reactive media dissociates the precursor at much lower temperatures than with CVD. PECVD systems offer excellent film uniformity, low-temperature processing, and high throughput. They are used in a wide range of applications and will play an increasingly important role in the semiconductor industry as the demand for advanced electronic devices continues to grow.

What Is Mpcvd?

MPCVD stands for Microwave Plasma Chemical Vapor Deposition and it is a process of depositing thin films onto a surface. It uses a vacuum chamber, microwave generator, and gas delivery system to create a plasma made up of reacting chemicals and necessary catalysts. MPCVD is heavily used in the ANFF network to deposit layers of diamond using methane and hydrogen to grow new diamond on a diamond-seeded substrate. It is a promising technology for producing low-cost, high-quality large diamonds and is extensively used in the semiconductor and diamond cutting industry.

What Is PECVD Used For?

PECVD (Plasma Enhanced Chemical Vapor Deposition) is widely used in the semiconductor industry to fabricate integrated circuits, as well as in the photovoltaic, tribological, optical, and biomedical fields. It is used to deposit thin films for microelectronic devices, photovoltaic cells, and display panels. PECVD can produce unique compounds and films that cannot be created by common CVD techniques alone, and films that demonstrate high solvent and corrosion resistance with chemical and thermal stability. It is also used to produce homogenous organic and inorganic polymers over large surfaces, and Diamond-like Carbon (DLC) for tribological applications.

What Is Mpcvd Machine?

The MPCVD (Microwave Plasma Chemical Vapor Deposition) machine is a laboratory equipment used to grow high-quality diamond films. It uses a carbon-containing gas and a microwave plasma to create a plasma ball above the diamond substrate, which heats it to a specific temperature. The plasma ball doesn't contact the cavity wall, making the diamond growth process free from impurities and enhancing the diamond's quality. The MPCVD system consists of a vacuum chamber, a microwave generator, and a gas delivery system that controls the flow of gas into the chamber.

What Are The Advantages Of PECVD?

The primary advantages of PECVD are its ability to operate at lower deposition temperatures, providing better conformity and step coverage on uneven surfaces, tighter control of the thin film process, and high deposition rates. PECVD allows for successful applications in situations where conventional CVD temperatures could potentially damage the device or substrate being coated. By operating at a lower temperature, PECVD creates less stress between thin film layers, allowing for high-efficiency electrical performance and bonding to very high standards.

What Are The Advantages Of Mpcvd?

MPCVD has several advantages over other methods of diamond production, such as higher purity, less energy consumption, and the ability to produce larger diamonds.

What Is The Difference Between ALD And PECVD?

ALD is a thin film deposition process that allows for atomic layer thickness resolution, excellent uniformity of high aspect ratio surfaces and pinhole-free layers. This is achieved by the continuous formation of atomic layers in a self-limiting reaction. PECVD, on the other hand, involves mixing the source material with one or more volatile precursors using a plasma to chemically interact and breakdown the source material. The processes use heat with higher pressures leading to a more reproducible film where the film thicknesses could be managed by time/power. These films are more stoichiometric, denser and are capable of growing higher quality insulator films.

Are CVD Diamonds Real Or Fake?

CVD diamonds are real diamonds and not fake. They are grown in a laboratory through a process called Chemical Vapor Deposition (CVD). Unlike natural diamonds that are mined from under the earth's surface, CVD diamonds are created using advanced technology in labs. These diamonds are 100% carbon and are the purest form of diamonds known as Type IIa diamonds. They have the same optical, thermal, physical, and chemical properties as natural diamonds. The only difference is that CVD diamonds are created in a lab and not mined from the earth.

What Is The Difference Between PECVD And Sputtering?

PECVD and sputtering are both physical vapor deposition techniques used for thin film deposition. PECVD is a diffusive gas-driven process that yields very high-quality thin films while sputtering is a line-of-sight deposition. PECVD allows for better coverage on uneven surfaces such as trenches, walls, and high conformity and can produce unique compounds and films. On the other hand, sputtering is good for the deposition of fine layers of several materials, ideal for creating multi-layered and multi-graduated coating systems. PECVD is mainly used in the semiconductor industry, tribological, optical, and biomedical fields while sputtering is mostly used for dielectric materials and tribological applications.
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4.9 / 5

The speed of this system is phenomenal! High-speed heating and cooling has drastically cut our research time. A game-changer for our lab.

Elara Vesper

4.8 / 5

Incredible value for such advanced tech. The precise gas flow control and RF plasma source deliver production-grade results in our R&D.

Caius Thorne

4.9 / 5

The build quality is exceptional. The stainless steel vacuum flange and safety features give us complete peace of mind during long runs.

Anya Sharma

4.7 / 5

A workhorse! The automated sliding movement and robust construction suggest this machine will be a cornerstone of our work for years.

Kenji Tanaka

4.9 / 5

The technological leap is real. The automatic plasma matching and touch screen interface make complex depositions surprisingly straightforward.

Soren Lindgren

4.8 / 5

Arrived faster than expected and set up was a breeze. The user-friendly interface had us running experiments on day one.

Zara Petrova

4.7 / 5

Outstanding performance for the price. The consistent film quality we achieve on solar cells is directly attributable to this machine's precision.

Rafael Silva

4.9 / 5

The durability is impressive. It handles continuous operation in our semiconductor processing line without a hiccup. A truly reliable investment.

Priya Kapoor

4.8 / 5

A marvel of engineering. The slide-out furnace for fast cooling is a brilliant feature that boosts our lab's overall efficiency significantly.

Lars Bjornsson

4.9 / 5

Top-tier advancement. The ability to eliminate color difference in our PECVD cells has elevated the quality of our entire product line.

Mei Lin Chen

4.7 / 5

Speed and quality in one package. The rapid processing time doesn't compromise the exceptional thin film results. Highly recommended.

Oscar Valdez

4.8 / 5

Worth every penny. The versatility for nanotechnology and materials science research is unmatched by any other system we've used.

Chloe Dubois

4.9 / 5

The attention to detail in safety and control is superb. The power failure restart function alone has saved us countless hours of work.

Akachi Nwosu

4.8 / 5

Seamless integration into our workflow. The remote control capabilities and data export make analysis and reporting incredibly efficient.

Leif Eriksen

Product Datasheet

Chemical Vapor Deposition CVD Equipment System Chamber Slide PECVD Tube Furnace with Liquid Gasifier PECVD Machine

Category Catalog

Cvd & Pecvd Furnace


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