Sputtering is a method of Physical Vapor Deposition (PVD) used to deposit thin films on substrates.
This technique involves the use of a gaseous plasma to dislodge atoms from a solid target material.
These atoms are then deposited onto the surface of the substrates to form a thin coating.
5 Key Steps Explained
1. Introduction of Gas
A controlled gas, typically argon, is introduced into a vacuum chamber.
2. Establishment of Plasma
An electrical current is applied to a cathode, creating a self-sustaining plasma.
3. Ejection of Atoms
Ions from the plasma collide with the target (cathode), causing atoms to be ejected.
4. Deposition of Thin Film
The ejected atoms deposit onto the substrates, forming a thin film.
5. Advantages and Applications
Sputtering is advantageous because it can deposit thin films from a wide range of materials, including those with high melting points.
It is used in various applications, such as semiconductors, CDs, disk drives, and optical devices.
The process can be controlled to produce precise compositions, including alloys and compounds through reactive sputtering.
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