The deposition of thin films using the sputtering method involves creating a thin layer of material on a desired substrate.
This process is achieved by applying a controlled gas flow, usually argon, into a vacuum chamber.
The target material, which is usually a metal, is placed as the cathode and charged with a negative electrical potential.
The plasma inside the chamber contains positively charged ions that are attracted to the cathode.
These ions collide with the target material, dislodging atoms from its surface.
The dislodged atoms, known as sputtered material, then cross the vacuum chamber and coat the substrate, forming a thin film.
The thickness of the film can range from a few nanometers to a few micrometers.
This deposition process is a physical vapor deposition method known as magnetron sputtering.
5 Key Points to Know About the Deposition of Thin Film Using Sputtering Method
1. Introduction to Sputtering Deposition
Sputtering deposition involves creating a thin layer of material on a desired substrate.
2. Gas Flow and Vacuum Chamber
The process is achieved by applying a controlled gas flow, usually argon, into a vacuum chamber.
3. Target Material and Electrical Potential
The target material, usually a metal, is placed as the cathode and charged with a negative electrical potential.
4. Plasma and Ion Collisions
The plasma inside the chamber contains positively charged ions that are attracted to the cathode.
These ions collide with the target material, dislodging atoms from its surface.
5. Formation of Thin Film
The dislodged atoms, known as sputtered material, then cross the vacuum chamber and coat the substrate, forming a thin film.
The thickness of the film can range from a few nanometers to a few micrometers.
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