Sputtering is a method used to create thin films and is a type of physical vapor deposition (PVD). Unlike some other vapor deposition methods, the material does not melt. Instead, atoms from the source material (target) are ejected by momentum transfer from a bombarding particle, typically a gaseous ion. This process allows for the deposition of thin films with excellent uniformity, density, purity, and adhesion. Sputtering can be performed bottom up or top down, and it is particularly advantageous for materials with very high melting points.
The process of sputtering involves the use of gaseous plasma to dislodge atoms from the surface of a solid target material. These atoms are then deposited to form an extremely thin coating on the surface of the substrates. The sputtering process sequence begins with the introduction of a controlled gas into a vacuum chamber containing the target and substrate. The gas is ionized, creating a plasma. Ions from the plasma are accelerated towards the target, where they collide with the target material, causing atoms to be ejected. These ejected atoms travel through the vacuum and deposit onto the substrate, forming a thin film.
Sputtering itself contains multiple sub-types, including direct current (DC), radio frequency (RF), mid-frequency (MF), pulsed DC, and HiPIMS, each with its own applicability. This versatility allows sputtering to be used to deposit coatings of both conductive and insulating materials with very high chemical purity onto essentially any substrate. The process is repeatable and can be used for medium to large batches of substrates, making it a valuable technology for a wide variety of applications, including semiconductors, CDs, disk drives, and optical devices.
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