The physical vapour deposition (PVD) sputtering process is a technique used to deposit thin films of metal or alloy coatings onto electrically conductive materials. It is carried out in a vacuum chamber at high vacuum using a cathodic arc source. The process involves the following steps:
1. Evaporation: A target material, typically a solid or liquid, is bombarded by a high-energy source such as a beam of electrons or ions. This dislodges atoms from the surface of the target, vaporizing them.
2. Transportation: The vaporized atoms then move from the target to the substrate or the material to be coated. This can occur through various mechanisms, such as diffusion or advection.
3. Reaction: Once the vaporized atoms reach the substrate, they undergo a condensation process. The atoms undergo a phase change from the vapor state to the solid state, forming a thin film on the substrate surface.
4. Deposition: The condensed atoms adhere to the substrate surface, forming a highly adhered pure metal or alloy coating. The thickness of the film can be controlled by adjusting the deposition time and other process parameters.
Sputtering is a specific method of physical vapor deposition (PVD) that involves the ejection of atoms or molecules from a target material by high-energy particle bombardment. In the sputtering process, the target material is bombarded with high-energy particles, typically ions, causing atoms or molecules to be dislodged from the target surface. These ejected atoms or molecules then condense on the substrate surface, forming a thin film.
Sputtering has become widely used in various applications, including the deposition of metallic films on wafers in VLSI fabrication. It allows for precise control of film thickness, uniformity, and composition. Common materials deposited by sputtering include aluminum, platinum, gold, and tungsten.
Overall, PVD sputtering is a versatile and widely used technique for depositing thin metal or alloy coatings onto substrates. It offers advantages such as high purity, good adhesion, and control over film properties.
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