PVD sputtering is a process used to deposit thin films of material onto a substrate.
It involves the use of high-energy ions to bombard a target material.
This causes atoms or molecules to be ejected and subsequently condense on a substrate as a thin film.
The process is conducted in a vacuum chamber, typically using argon gas.
It is a dry, low-temperature method suitable for temperature-sensitive products.
How does PVD sputtering process work? – A 4-Step Guide
1. Setup and Vacuum Conditions
The target material, often a solid metal or compound, is positioned in a vacuum chamber.
The chamber is then evacuated to create the desired vacuum conditions.
2. Ionization and Bombardment
Argon gas is introduced into the chamber and ionized to form a plasma.
This plasma is then used to bombard the target material with high-energy argon ions.
3. Ejection and Deposition
The bombardment ejects atoms or molecules from the target material.
These ejected particles travel through the vacuum and deposit onto the substrate, forming a thin film.
4. Control and Parameters
Several critical parameters must be controlled to ensure the quality of the deposited film.
These include the type of gas used, the voltage applied, and the positioning of the target and substrate.
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