The different types of chemical vapor deposition (CVD) can be classified based on process pressure and activation sources for the chemical reactions.
1. Classification based on process pressure:
a) Atmospheric Pressure CVD (APCVD): This process is carried out at atmospheric pressure and is suitable for large-scale production. It is commonly used for depositing oxide films.
b) Low Pressure CVD (LPCVD): LPCVD is conducted at reduced pressure, typically below atmospheric pressure. It allows for better control over the deposition process and is commonly used for depositing polysilicon, silicon nitride, and various metals.
c) Ultra-High Vacuum CVD (UHVCVD): UHVCVD operates at extremely low pressures, close to vacuum conditions. It is used for depositing high-purity and defect-free films, especially in applications where contamination is a concern.
2. Classification based on activation sources for the chemical reactions:
a) Thermally Activated CVD: In this conventional CVD method, the gaseous precursors are dissociated thermally and deposited on a heated substrate. It requires high reaction temperatures, limiting the use of substrates with lower melting points. Tungsten filaments are commonly used as heating sources in CVD reactors for this technique.
b) Plasma Enhanced CVD (PECVD): PECVD involves the use of plasma to enhance the chemical reactions and deposition process. Plasma is created by applying a radio-frequency or microwave power source to the reaction chamber. PECVD is commonly used for depositing high-quality films, such as passivation layers or high-density masks.
In addition to these classifications, there are also specific subgroups of chemical vapor deposition methods, such as chemical bath deposition, electroplating, molecular beam epitaxy, and thermal oxidation. These methods are used for specific applications and offer unique advantages in thin film technologies.
Overall, chemical vapor deposition is a versatile technique used for depositing thin films and coatings of various materials. It offers control over film composition, thickness, and quality, making it valuable in a wide range of industries and applications.
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