Chemical vapor deposition (CVD) is a versatile technique used for depositing thin films and coatings of various materials.
It can be classified based on two main criteria: process pressure and activation sources for the chemical reactions.
What are the different types of chemical Vapour deposition? (4 Key Types Explained)
1. Classification based on process pressure
a) Atmospheric Pressure CVD (APCVD)
Atmospheric Pressure CVD (APCVD) is carried out at atmospheric pressure.
It is suitable for large-scale production.
APCVD is commonly used for depositing oxide films.
b) Low Pressure CVD (LPCVD)
Low Pressure CVD (LPCVD) is conducted at reduced pressure, typically below atmospheric pressure.
It allows for better control over the deposition process.
LPCVD is commonly used for depositing polysilicon, silicon nitride, and various metals.
c) Ultra-High Vacuum CVD (UHVCVD)
Ultra-High Vacuum CVD (UHVCVD) operates at extremely low pressures, close to vacuum conditions.
It is used for depositing high-purity and defect-free films.
UHVCVD is especially important in applications where contamination is a concern.
2. Classification based on activation sources for the chemical reactions
a) Thermally Activated CVD
In Thermally Activated CVD, the gaseous precursors are dissociated thermally and deposited on a heated substrate.
This method requires high reaction temperatures.
It limits the use of substrates with lower melting points.
Tungsten filaments are commonly used as heating sources in CVD reactors for this technique.
b) Plasma Enhanced CVD (PECVD)
Plasma Enhanced CVD (PECVD) involves the use of plasma to enhance the chemical reactions and deposition process.
Plasma is created by applying a radio-frequency or microwave power source to the reaction chamber.
PECVD is commonly used for depositing high-quality films, such as passivation layers or high-density masks.
Additional Methods
In addition to these classifications, there are also specific subgroups of chemical vapor deposition methods.
These include chemical bath deposition, electroplating, molecular beam epitaxy, and thermal oxidation.
These methods are used for specific applications and offer unique advantages in thin film technologies.
Continue exploring, consult our experts
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