Chemical Vapor Deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials, often in the form of thin films.
The process involves exposing a substrate to one or more volatile precursors.
These precursors react and/or decompose on the substrate surface to produce the desired deposit.
By-products are typically removed by gas flow through the reaction chamber.
4 Key Points About Chemical Vapour Deposition
1. Principle
CVD utilizes gaseous or vapor substances to react at the gas-phase or gas-solid interface.
This results in solid deposits on a substrate.
2. Process
The CVD process consists of three main stages:
- Diffusion of the reaction gas onto the substrate surface.
- Adsorption of the reaction gas onto the substrate surface.
- Chemical reaction on the substrate surface to form a solid deposit.
By-products are released from the substrate surface.
Common reactions include thermal decomposition, chemical synthesis, and chemical transport.
3. Characteristics
CVD offers a wide variety of deposits, including metal films, non-metal films, multi-component alloy films, and ceramic or compound layers.
The process can be performed at atmospheric pressure or low vacuum.
This allows for uniform coating on complex-shaped surfaces.
CVD coatings are characterized by high purity, good denseness, low residual stress, and good crystallization.
4. Applications and Variations
CVD is used to produce a wide range of materials in different compositions and forms, such as carbides, nitrides, oxynitrides, and various forms of carbon.
The process is adaptable to different microstructures like monocrystalline, polycrystalline, and amorphous.
CVD is also used in the production of polymers for applications in biomedical devices, circuit boards, and durable coatings.
The process is categorized into atmospheric pressure CVD, low-pressure CVD, and ultra-high vacuum CVD, with additional classifications based on substrate heating, material properties, and types of plasma used.
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