The advantage of thermal evaporation method over sputtering method is that thermal evaporation offers faster evaporation rates. This means that the deposition process can be completed more quickly, resulting in higher throughput and high-volume production. Thermal evaporation is also more cost-effective and less complex compared to sputtering.
Furthermore, thermal evaporation allows for the deposition of thick films using flash evaporation or other methods that use crucibles. This is particularly advantageous when depositing materials that require a thicker coating. In contrast, sputtering offers better film quality and uniformity, potentially leading to a higher yield. It also offers scalability, although at a higher cost and with more complex setups.
Thermal evaporation is particularly suitable for depositing thinner films of metals or nonmetals, especially those with lower melting temperatures. It is also useful for materials that require improved step coverage or when working with a wide selection of materials. The energies involved in thermal evaporation processes are dependent on the temperature of the source material being evaporated, which reduces the possibility of damaging the substrate.
On the other hand, sputtering has better step coverage, which means more uniform thin film coverage on uneven surfaces. It tends to deposit thin films more slowly than thermal evaporation. Sputtering uses a plasma, which produces many high-speed atoms that can bombard the substrate and potentially cause damage. In contrast, evaporated atoms have a Maxwellian energy distribution determined by the temperature of the source, resulting in fewer high-speed atoms and lower risk of substrate damage.
In summary, the advantage of thermal evaporation over sputtering is the faster evaporation rates, cost-effectiveness, and simplicity. However, sputtering offers better film quality and uniformity, as well as scalability. The choice between the two methods depends on the specific requirements of the deposition process, such as the thickness of the coating, the material being deposited, and the desired film quality.
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