Knowledge What is the RF frequency used for sputtering process?
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Tech Team · Kintek Solution

Updated 2 weeks ago

What is the RF frequency used for sputtering process?

The RF frequency commonly used for the sputtering process is typically in the range of 5-30 MHz, with 13.56 MHz being the most frequently used frequency. This frequency is standardized by the ITU Radio Regulations for industrial, scientific, and medical (ISM) instruments to avoid interference with telecommunication services. The choice of 13.56 MHz is strategic as it is low enough to allow sufficient time for momentum transfer of argon ions to the target, which is crucial for effective sputtering. At higher frequencies, the role of ions diminishes, and the process becomes more electron-dominated, akin to e-beam evaporation.

The use of 13.56 MHz in RF sputtering is particularly advantageous for depositing insulating materials. Unlike direct current (DC) sputtering, which is suitable for conductive materials, RF sputtering utilizes radio frequency power supplies that can handle materials with insulating properties. This method allows for the maintenance of an inert gas plasma at a lower pressure (less than 15 mTorr) compared to DC sputtering, which requires a higher pressure (around 100 mTorr). This lower pressure environment reduces collisions between target material particles and gas ions, facilitating a more direct deposition pathway onto the substrate.

RF sputtering's mechanism involves alternating the electrical potential at radio frequencies to prevent charge buildup on the target surface. Each cycle of the RF current effectively cleans the target surface by reversing the charge buildup that would accumulate with a continuous current flow in one direction. This cleaning effect is crucial for maintaining the efficiency of the sputtering process, especially for insulating targets where charge accumulation can impede the deposition process.

In summary, the RF frequency of 13.56 MHz is extensively used in sputtering due to its compatibility with ISM standards, its effectiveness in handling insulating materials, and its ability to operate at lower pressures, enhancing the directness and efficiency of the deposition process.

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