The RF frequency commonly used for the sputtering process is typically in the range of 5-30 MHz.
13.56 MHz is the most frequently used frequency.
This frequency is standardized by the ITU Radio Regulations for industrial, scientific, and medical (ISM) instruments.
The standardization helps avoid interference with telecommunication services.
4 Key Points About RF Frequency in Sputtering
1. Strategic Choice of 13.56 MHz
The choice of 13.56 MHz is strategic.
It is low enough to allow sufficient time for momentum transfer of argon ions to the target.
This is crucial for effective sputtering.
At higher frequencies, the role of ions diminishes.
The process becomes more electron-dominated, akin to e-beam evaporation.
2. Advantage for Insulating Materials
The use of 13.56 MHz in RF sputtering is particularly advantageous for depositing insulating materials.
Unlike direct current (DC) sputtering, which is suitable for conductive materials, RF sputtering utilizes radio frequency power supplies.
These power supplies can handle materials with insulating properties.
RF sputtering allows for the maintenance of an inert gas plasma at a lower pressure (less than 15 mTorr).
DC sputtering requires a higher pressure (around 100 mTorr).
This lower pressure environment reduces collisions between target material particles and gas ions.
It facilitates a more direct deposition pathway onto the substrate.
3. Mechanism of RF Sputtering
RF sputtering's mechanism involves alternating the electrical potential at radio frequencies.
This prevents charge buildup on the target surface.
Each cycle of the RF current effectively cleans the target surface.
It reverses the charge buildup that would accumulate with a continuous current flow in one direction.
This cleaning effect is crucial for maintaining the efficiency of the sputtering process.
Especially for insulating targets where charge accumulation can impede the deposition process.
4. Summary of RF Frequency Benefits
In summary, the RF frequency of 13.56 MHz is extensively used in sputtering.
It is due to its compatibility with ISM standards.
It is effective in handling insulating materials.
It operates at lower pressures, enhancing the directness and efficiency of the deposition process.
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