Knowledge What Materials are Deposited in PECVD? (4 Key Materials Explained)
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Tech Team · Kintek Solution

Updated 3 months ago

What Materials are Deposited in PECVD? (4 Key Materials Explained)

PECVD, or Plasma-Enhanced Chemical Vapor Deposition, is a low-temperature deposition technique that uses plasma to enhance the deposition process. This method is capable of depositing a wide range of materials, making it a versatile tool in various industries.

What Materials are Deposited in PECVD? (4 Key Materials Explained)

What Materials are Deposited in PECVD? (4 Key Materials Explained)

1. Silicon-based Films

  • Polysilicon: This material is widely used in semiconductor devices. Polysilicon is deposited by PECVD at low temperatures, which is essential for preserving the integrity of the substrate.
  • Silicon Oxide and Silicon Nitride: These materials are commonly used as insulators and passivation layers in microelectronic devices. PECVD allows for their deposition at temperatures below 400°C, which is beneficial for temperature-sensitive substrates.

2. Diamond-like Carbon (DLC)

  • DLC is a form of amorphous carbon known for its significant hardness. It is used in applications requiring high wear resistance and low friction. PECVD is effective in depositing DLC due to its ability to handle complex chemistries at low temperatures.

3. Metal Compounds

  • Oxides, Nitrides, and Borides: These materials are used in various applications, including hard coatings, electrical insulators, and diffusion barriers. PECVD's ability to deposit these materials at low temperatures makes it suitable for a wide range of substrates.

4. Applications

  • PECVD films play a crucial role in many devices, serving as encapsulants, passivation layers, hard masks, and insulators. They are also used in optical coatings, RF filter tuning, and as sacrificial layers in MEMS devices.

Continue exploring, consult our experts

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