Assay Equipment Accessories & Consumables
Fused Quartz Reducing Tube High Purity Quartz Reducer Adapter for Laboratory Tube Furnaces and Semiconductor Processing
Item Number : KT-SYG
Price varies based on specs and customizations
- Material Composition
- High Purity Fused Quartz (SiO2 ≥ 99.99%)
- Operating Temperature
- 1100°C Continuous / 1250°C Short-term Peak
- Thermal Shock Resistance
- Water Quench from 1100°C to 20°C Without Fracture
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Product Overview
The high purity fused quartz reducing tube serves as a precision transition coupling engineered to connect unequal tube diameters across high-temperature furnaces, vacuum networks, and process piping. Fabricated from refined fused silica with silicon dioxide content surpassing 99.99%, this component delivers outstanding thermal resilience, optical clarity, and chemical inertness, ensuring reliable volumetric flow transitions without dead zones or structural failure.
Widely deployed across semiconductor fabrication, chemical vapor deposition, photovoltaic research, and analytical pyrochemical laboratories, this adapter interfaces primary furnace chambers with gas delivery manifolds, exhaust scrubbers, and vacuum fittings. It eliminates geometric interface mismatches in harsh thermal systems where elastomeric or metal couplings are unsuitable due to thermal degradation or contamination risks.
Engineered for continuous operation at 1100°C and transient peaks to 1250°C, the component features an exceptionally low coefficient of thermal expansion, granting total immunity to rapid thermal shock during aggressive furnace cycles. Uniform wall thickness, precise concentricity, and full furnace annealing guarantee long-term mechanical strength under rigorous vacuum and positive pressure conditions.
Key Features
- Ultra-High Material Purity: Manufactured exclusively from premium fused silica with SiO2 purity exceeding 99.99% and total metallic trace impurities below 20 ppm, ensuring zero risk of substrate contamination in ultra-clean semiconductor, solar cell, and thin-film deposition processes.
- Superior Thermal Shock Resilience: Possesses an ultra-low thermal expansion coefficient of 5.5 × 10⁻⁷ /°C across ambient to 1000°C, permitting direct exposure to acute thermal gradients and instantaneous water quenching from 1100°C without micro-cracking, crazing, or catastrophic thermal fracture.
- Precision Lathe-Formed Geometry: Fabricated using computer-synchronized quartz-working glass lathes to maintain tight concentricity, smooth taper transitions, and uniform wall thickness across both the major and minor bore sections, preventing localized thermal stress and turbulent gas recirculation.
- Broad Spectrum Chemical Inertness: Exhibits near-total immunity to corrosive acids including concentrated nitric, sulfuric, and hydrochloric acids at boiling temperatures, as well as dry halogens and volatile precursor vapors, protecting process chemistry integrity across demanding chemical environments.
- High-Temperature Structural Rigidity: Retains exceptional mechanical stability under continuous operating conditions at 1100°C and intermittent peak excursions up to 1250°C, resisting sagging, softening, or vacuum implosion under deep negative pressure regimes.
- Optical Transparency and Process Visibility: Delivers high spectral transmission across the ultraviolet, visible, and near-infrared spectra from 260 nm to 2500 nm, allowing clear visual monitoring of plasma discharges, precursor flows, and vapor condensation zones during thermal processing.
- Customizable End Terminations and Joint Interfaces: Engineered with versatile connection configurations, including precision fire-polished plain ends, standard ground taper joints, spherical ball-and-socket couplings, or beaded quick-flange profiles to integrate seamlessly into diverse apparatus layouts.
- Controlled Furnace Annealing: Undergoes multi-stage programmed cycle annealing to eradicate residual internal stresses introduced during mechanical drawing and hot tapering, verified via optical polariscope testing to ensure dependable physical durability during service.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Semiconductor Diffusion and Oxidation | Connects large-bore process tubes to smaller reactive gas delivery injectors or foreline vacuum flanges within high-temperature diffusion furnaces. | Prevents metallic contamination, maintains ultra-clean atmospheric seals, and withstands continuous 1100°C process cycles without devitrification. |
| Chemical Vapor Deposition (CVD / PECVD) | Acts as the primary gas-flow reducer bridging reactant delivery conduits to the main vacuum deposition chamber in horizontal or vertical tube systems. | Eliminates turbulent recirculation zones through smooth taper geometry, ensuring laminar precursor flow and uniform thin-film growth. |
| High-Vacuum Exhaust and Foreline Transitions | Bridges oversized process chambers with standard vacuum pumping lines, cold traps, and diagnostic pressure sensors in high-vacuum setups. | Delivers negligible outgassing rates under ultra-high vacuum conditions while sustaining deep vacuum differentials without structural buckling. |
| Corrosive Gas Scrubbing and Vent Lines | Interfaces corrosive effluent streams containing chlorine, fluorine compounds, or acidic byproducts to condensation traps and neutralizer towers. | Impervious to acid mist and halogens at elevated exhaust temperatures, preventing premature coupling corrosion and catastrophic exhaust leaks. |
| Laboratory Tube Furnace Bore Reduction | Facilitates dimensional conversion between large furnace heating tubes and standardized laboratory glassware or analytical probe insertion ports. | Allows researchers to adapt legacy furnace tube diameters to modular apparatus without custom machining expensive furnace end-caps. |
| Photovoltaic Silicon Wafer Processing | Serves as transition ducting for phosphorus oxychloride or boron tribromide dopant vapor delivery in solar cell emitter diffusion reactors. | Resists aggressive dopant carrier vapor corrosion while preserving extreme chemical purity critical for high carrier lifetime efficiency. |
| Pyrochemical and Thermal Analysis | Couples high-temperature combustion boats or reaction tubes directly to mass spectrometers, optical gas analyzers, and condenser coils. | Provides inert flow pathways preventing sample adsorption, catalytic side-reactions, or signal distortion during sensitive analytical evaluations. |
| Optical Fiber Preform Deposition (MCVD) | Connects rotating quartz starting tubes to chemical feed manifolds and exhaust blowers during modified chemical vapor deposition for fiber cores. | Ensures high rotational concentricity and mechanical strength under intense oxy-hydrogen flame traversing along the preform axis. |
Technical Specifications
Standard Dimensional Variants
| Product Model | Major Outer Diameter (OD1) | Minor Outer Diameter (OD2) | Wall Thickness (W) | Taper Length (L1) | Overall Length (L) | Transition Geometry |
|---|---|---|---|---|---|---|
| KT-SYG-2515 | 25 mm (±0.3 mm) | 15 mm (±0.3 mm) | 2.0 mm (±0.2 mm) | 30 mm | 150 mm | Concentric |
| KT-SYG-3825 | 38 mm (±0.5 mm) | 25 mm (±0.3 mm) | 2.5 mm (±0.3 mm) | 40 mm | 180 mm | Concentric |
| KT-SYG-5025 | 50 mm (±0.5 mm) | 25 mm (±0.3 mm) | 3.0 mm (±0.3 mm) | 50 mm | 200 mm | Concentric |
| KT-SYG-6040 | 60 mm (±0.5 mm) | 40 mm (±0.5 mm) | 3.0 mm (±0.3 mm) | 50 mm | 220 mm | Concentric |
| KT-SYG-8050 | 80 mm (±0.8 mm) | 50 mm (±0.5 mm) | 3.5 mm (±0.3 mm) | 60 mm | 250 mm | Concentric |
| KT-SYG-10060 | 100 mm (±0.8 mm) | 60 mm (±0.5 mm) | 4.0 mm (±0.4 mm) | 80 mm | 300 mm | Concentric |
| KT-SYG-12080 | 120 mm (±1.0 mm) | 80 mm (±0.8 mm) | 4.5 mm (±0.4 mm) | 90 mm | 320 mm | Concentric |
| KT-SYG-150100 | 150 mm (±1.2 mm) | 100 mm (±0.8 mm) | 5.0 mm (±0.5 mm) | 100 mm | 350 mm | Concentric |
| KT-SYG-5025E | 50 mm (±0.5 mm) | 25 mm (±0.3 mm) | 3.0 mm (±0.3 mm) | 55 mm | 200 mm | Eccentric Flat-Bottom |
| KT-SYG-8050E | 80 mm (±0.8 mm) | 50 mm (±0.5 mm) | 3.5 mm (±0.3 mm) | 65 mm | 250 mm | Eccentric Flat-Bottom |
| KT-SYG-10060E | 100 mm (±0.8 mm) | 60 mm (±0.5 mm) | 4.0 mm (±0.4 mm) | 85 mm | 300 mm | Eccentric Flat-Bottom |
| KT-SYG-CUSTOM | 10 mm – 450 mm | 5 mm – 350 mm | 1.5 mm – 10.0 mm | Custom Defined | 50 mm – 1200 mm | Concentric / Eccentric |
Material Physical and Thermal Properties
| Parameter | Test Standard / Unit | Value / Characteristic |
|---|---|---|
| Chemical Composition | Spectroscopy | High Purity Fused Quartz (SiO2 ≥ 99.99%) |
| Material Density | Archimedes / g/cm³ | 2.20 g/cm³ |
| Continuous Operating Temperature | In-Service Thermal Limit | 1100°C |
| Maximum Short-Term Operating Limit | Peak Excursion Threshold | 1250°C |
| Softening Point | ASTM C338 | 1730°C |
| Annealing Point | ASTM C336 | 1180°C |
| Strain Point | ASTM C336 | 1120°C |
| Coefficient of Thermal Expansion (CTE) | Dilatometry (20°C – 1000°C) | 5.5 × 10⁻⁷ /°C |
| Thermal Shock Resistance | Water Quench Test | 1100°C to 20°C Without Fracture |
| Thermal Conductivity | 20°C / W/(m·K) | 1.4 W/(m·K) |
| Tensile Strength | Mechanical Test / MPa | 48 MPa |
| Compressive Strength | Mechanical Test / MPa | 1100 MPa |
| Young's Modulus (Modulus of Elasticity) | Acoustic Resonance / GPa | 72 GPa |
| Poisson's Ratio | Mechanical / Dimensionless | 0.17 |
| Dielectric Constant | 1 MHz at 25°C | 3.75 |
| Refractive Index (nD) | Optical Sodium D-Line (589.3 nm) | 1.4585 |
| Optical Transmittance | 260 nm – 2500 nm Spectrometry | > 90% |
Typical Chemical Trace Impurity Profile
| Element | Symbol | Concentration (ppm by weight) |
|---|---|---|
| Aluminum | Al | 12.0 – 16.0 |
| Iron | Fe | 0.2 – 0.6 |
| Calcium | Ca | 0.4 – 0.9 |
| Magnesium | Mg | 0.1 – 0.4 |
| Sodium | Na | 0.5 – 1.2 |
| Potassium | K | 0.4 – 0.8 |
| Lithium | Li | 0.2 – 0.5 |
| Copper | Cu | < 0.05 |
| Total Metallic Impurities | Total Metal Content | < 20.0 ppm |
End Termination and Fitting Options
| Termination Style | Standard Available | Typical Application Connection |
|---|---|---|
| Fire-Polished Plain Ends | Standard smooth cut and flame-glazed | Ultra-Torr fittings, compression o-ring seals, furnace end flanges |
| Ground Glass Taper Joints | Standard taper ST 14/23, 19/26, 24/29, 29/32, 45/40 | Direct interchangeable glassware connections without polymer adaptors |
| Spherical Ball-and-Socket Joints | Semi-ball joints S13, S19, S28, S35, S50 | Angular adjustment lines, stress-free thermal expansion joints |
| Beaded Quick-Flange Ends | Quartz beaded ends for O-ring clamps | Vacuum pipe clamp couplings, high-purity foreline manifolds |
| Fused Quartz Flanges | Polished flat faces with bolt holes or slotted edges | Direct bolting to metal vacuum assemblies or reactor viewports |
Why Choose This Product
- Precision Lathe Hot-Forming Technology: Advanced automated glass-working lathes control wall thickness reduction across the conical transition zone, eliminating structural thin spots and uneven thermal stresses common to manually hand-drawn reducers.
- Uncompromising Chemical and Matrix Purity: Sourced strictly from refined electric-melted quartz containing less than 20 ppm cumulative metallic impurities, safeguarding sensitive wafer runs, catalytic beds, and CVD thin-film depositions from elemental cross-contamination.
- Validated Zero-Stress Annealing: Every piece undergoes automated furnace ramp annealing followed by comprehensive polariscopic strain inspections, ensuring zero residual mechanical tension and complete resilience against thermal shock.
- Concentric and Eccentric Layout Engineering: Offered in both standard concentric forms for symmetrical flow dynamics and flat-bottom eccentric configurations that eliminate liquid condensate pooling in horizontal exhaust and recovery lines.
- Comprehensive Dimensional Customization: We engineer custom diameter ratios, unique transition angles, extended leg lengths, and tailored termination flanges matched directly to proprietary process tools and legacy tube furnaces.
Contact our technical engineering team today to review your dimensional specifications, discuss tailored glassblowing solutions, or obtain a competitive quotation for immediate delivery.
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