Measuring the thickness of a deposited thin film during evaporation is crucial for ensuring the quality and uniformity of the film.
There are two primary methods used to measure this thickness: stylus profilometry and interferometry.
2 Methods Explained
1. Stylus Profilometry
Stylus profilometry involves using a stylus that moves across the surface of the film.
The stylus detects the vertical movement as it encounters a groove or step, which corresponds to the thickness of the film.
This method is straightforward and can provide detailed surface profiles.
However, it requires physical contact with the film, which might damage delicate surfaces.
2. Interferometry
Interferometry uses light waves to measure the thickness of the film.
When light is reflected off the film and the substrate, interference patterns are created due to the difference in optical path lengths.
These interference fringes can be analyzed to determine the thickness of the film.
This method is non-invasive and suitable for delicate films, but it can be more complex to interpret the interference patterns compared to stylus profilometry.
Optimization and Considerations
The accuracy of these measurements is influenced by several factors.
These include the purity of the deposited film, which depends on the quality of the vacuum and the purity of the source material.
Higher deposition rates under a given vacuum pressure can lead to higher film purity by minimizing the inclusion of gaseous impurities.
The geometry of the evaporation chamber and collisions with residual gases can affect the uniformity of the film thickness.
For thicker films, methods like thermal evaporation using evaporation boats and crucibles are preferred over wire filaments, which are limited by the size of the filament.
Electron-beam evaporation allows for tight control of the evaporation rate, making it suitable for depositing complex materials or compounds.
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