The thickness of the plasma nitriding layer can vary depending on various factors such as the type of material being treated, the nitriding temperature, and the treatment time.
In the provided references, it is mentioned that the thickness of the diffusion layer formed by plasma nitriding is approximately 80 µm. This thickness was observed in the micrographs shown in Figure 1.
Moreover, it is stated that the depth of the diffusion layer also depends on the nitriding temperature, part uniformity, and time. For a given temperature, the case depth increases approximately as the square root of time. This indicates that the longer the treatment time, the deeper the nitriding layer can penetrate.
Additionally, the plasma power or current density is mentioned as another process variable that can influence the thickness of the compound layer. The plasma power is a function of the surface area and can affect the formation and thickness of the compound layer.
Furthermore, it is mentioned that plasma nitrocarburizing is an alternative to plasma nitriding for achieving particularly thick compound layers. The depth of the nitrocarburizing layer can vary depending on the material used, the treatment temperature, and the treatment time.
In summary, the thickness of the plasma nitriding layer can vary depending on factors such as the type of material, nitriding temperature, treatment time, and plasma power. However, based on the provided references, the thickness of the diffusion layer formed by plasma nitriding is approximately 80 µm.
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