Knowledge What is Deposition in Semiconductor Process? 4 Key Techniques Explained
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Updated 2 months ago

What is Deposition in Semiconductor Process? 4 Key Techniques Explained

Deposition in the semiconductor process refers to the techniques used to create thin or thick layers of materials on a solid surface. These layers are essential for building semiconductor devices. They can be either dielectric (insulating) or metal (conducting) materials. Various deposition technologies are used to form these layers.

4 Key Techniques in Semiconductor Deposition

What is Deposition in Semiconductor Process? 4 Key Techniques Explained

Chemical Vapor Deposition (CVD)

Chemical Vapor Deposition (CVD) is a method used to produce high-quality, high-performance solid materials. It is typically done under vacuum. CVD is often employed in the manufacture of semiconductors and the production of thin films. In CVD, gaseous precursors react and deposit on a substrate, forming a solid layer. This process is crucial for creating layers of materials with precise control over thickness and uniformity.

Sputtering

Sputtering is another thin film deposition process. In this process, atoms are ejected from a target material and deposited on a substrate due to bombardment by high-energy particles. This technique is widely used in the semiconductor industry, as well as in the production of disk drives, CDs, and optical devices. Sputtering allows for the deposition of a wide range of materials with good adhesion and uniformity.

Thin Film Deposition

Thin Film Deposition encompasses all technologies used to form thin films on substrates. These films are crucial for fabricating microelectronic devices. Different deposition technologies are employed depending on the type of material and structure being made. For example, Electrochemical Deposition (ECD) is used to create the copper "wiring" that interconnects devices in an integrated circuit. Metal plating is used for through-silicon vias and wafer-level packaging applications. Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) are used to create tiny tungsten connectors and thin barriers, adding only a few layers of atoms at a time. Plasma-enhanced CVD (PECVD), high-density plasma CVD (HDP-CVD), and ALD are used to form critical insulating layers that isolate and protect electrical structures.

Importance of Deposition Processes

These deposition processes are vital for the semiconductor industry. They enable the creation of complex structures with precise control over material properties. This is essential for the functionality and performance of semiconductor devices.

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