When it comes to creating thin films, two common methods are thermal and electron beam evaporation.
These methods differ mainly in how they vaporize the material.
1. Heating Method
Thermal Evaporation: This method uses an electric current to heat a crucible.
The crucible contains the material that needs to be vaporized.
As the crucible heats up, the material inside melts and then evaporates.
Electron Beam Evaporation: This method uses a beam of high-energy electrons to directly heat the material.
The high-energy electrons heat the material to a high temperature, causing it to evaporate.
2. Material Suitability
Thermal Evaporation: This method is best for materials that have lower melting points.
Examples include metals and non-metals.
Electron Beam Evaporation: This method can handle materials with higher melting points.
It is particularly good for refractory metals like tungsten, tantalum, or graphite.
3. Purity and Impurities
Thermal Evaporation: This method can result in less dense thin film coatings.
There is also a greater risk of impurities because the crucible is heated.
Electron Beam Evaporation: This method generally results in higher purity films.
The localized heating and the absence of crucible heating reduce the risk of impurities.
4. Deposition Rate
Thermal Evaporation: The deposition rate is generally lower compared to electron beam evaporation.
Electron Beam Evaporation: This method offers higher deposition rates.
5. Complexity and Cost
Thermal Evaporation: This method is simpler and less costly.
Electron Beam Evaporation: This method requires complex and costly electronics.
It also needs advanced safety features.
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